Micro LED Display Panel Via-Based Wavelength Conversion
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Solution Overview
Problem
Conventional micro LED display panels face difficulties in patterning a thick wavelength conversion layer, which can lead to interference issues between adjacent subpixels due to its increased thickness, and struggle to maintain high etch selectivity for precise subpixel aperture formation.
Innovation Solution
The micro LED display panel incorporates a carrier substrate layer with vias filled with a wavelength conversion material, allowing for a thick wavelength conversion layer to be fabricated while maintaining high etch selectivity for subpixel aperture definition, and includes an etch stop layer to define subpixel apertures and connect signal lines through the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a thick wavelength conversion layer is used to reduce blue light transmission, then light conversion efficiency is improved, but patterning precision deteriorates due to interference between adjacent subpixels
Solution Approach 1:
The wavelength conversion layer is segmented into multiple independent via structures, each containing wavelength conversion material. This segmentation allows precise control of each subpixel aperture while maintaining adequate thickness for blue light absorption, preventing interference between adjacent subpixels.
Solution Approach 2:
The patent transitions from a planar wavelength conversion layer to a three-dimensional via-based structure. By distributing wavelength conversion material vertically through via holes, the design achieves both sufficient thickness for light conversion and precise lateral positioning to avoid subpixel interference.
2Loss of energy
If a thick wavelength conversion layer is fabricated, then blue light absorption is improved, but etch selectivity for subpixel aperture formation deteriorates
Solution Approach 1:
An etch stop layer is introduced as an intermediary between the carrier substrate and the wavelength conversion structures. This etch stop layer provides a clear etching boundary, enabling precise subpixel aperture formation even when fabricating thick wavelength conversion layers, thereby maintaining high etch selectivity.
3Loss of energy
If wavelength conversion material is distributed to ensure adequate thickness, then blue light conversion is improved, but device complexity increases
Solution Approach 1:
The patent employs a porous via structure filled with wavelength conversion material. This approach allows the wavelength conversion material to be distributed throughout the via holes, ensuring adequate thickness and effective blue light conversion while maintaining a relatively simple overall device structure through the use of standard via formation processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the fabrication of a micro LED display panel with a thick wavelength conversion layer that reduces blue light transmission to negligible levels, avoids interference between subpixels, and ensures precise subpixel aperture formation, enhancing display performance.
Implementation Method 1
a wavelength conversion layer comprising a wavelength conversion material filled in the plurality of vias
Data Source
AI summary
A micro light emitting diode (micro LED) display panel includes a carrier substrate layer; a plurality of vias respectively extending into the carrier substrate layer; a plurality of micro LEDs on the carrier substrate layer; and a wavelength conversion layer including a wavelength conversion material filled in the plurality of vias.