Micro-LED Wafer Slicing With Bonded Epitaxial Layer Assembly
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Solution Overview
Problem
The complex and costly manufacturing process of traditional light emitting diode (LED) chips requires a high cost and involves intricate stacking of epitaxial layers, which can be simplified by using a slicing micro-LED wafer approach.
Innovation Solution
A slicing micro-LED wafer is formed by bonding epitaxial layer slices onto a driver circuit substrate with a bonding layer, allowing for the efficient formation of micro-LED chips through a less complex process compared to traditional methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional LED chip manufacturing process is used with stacking epitaxial layers, then the LED chips can be produced, but the manufacturing process becomes complicated and manufacturing cost increases
Solution Approach 1:
The patent divides the epitaxial wafer into multiple thin epitaxial layer slices through slicing, allowing each slice to be independently handled and bonded to the driver circuit substrate. This segmentation simplifies the manufacturing process by replacing complex multi-layer stacking with a more manageable slicing and bonding approach.
Solution Approach 2:
The patent performs preliminary slicing of the epitaxial wafer into thin layers before bonding to the driver circuit substrate. This preliminary action prepares the material in advance, making the subsequent bonding process simpler and reducing overall manufacturing complexity.
2Reliability
If traditional LED chip manufacturing process is used with stacking epitaxial layers, then the LED chips can be produced, but the manufacturing cost increases
Solution Approach 1:
By slicing the epitaxial wafer into thin layers, the patent enables more efficient material utilization and simplifies the bonding process, thereby reducing manufacturing costs while maintaining production capability.
Solution Approach 2:
The patent creates multiple copies of the epitaxial layer structure by slicing, allowing parallel processing and assembly on the driver circuit substrate. This copying approach improves manufacturing efficiency and reduces per-unit cost.
3Device complexity
If epitaxial layer slices are bonded to driver circuit substrate, then manufacturing complexity and cost are reduced, but bonding reliability must be maintained
Solution Approach 1:
The patent introduces a bonding layer as an intermediary between the epitaxial layer slices and the driver circuit substrate. This bonding layer ensures reliable electrical and mechanical connection while allowing the simplified slicing approach to be used, thus maintaining bonding reliability despite the reduced manufacturing complexity.
Solution Approach 2:
The patent controls the thickness of the epitaxial layer slices within a specific range (1-10 micrometers) to optimize both the bonding reliability and the simplification of the manufacturing process. This parameter control ensures that the slices are thin enough to simplify handling but thick enough to maintain electrical performance and bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing complexity and cost while maintaining the ability to produce micro-LED chips that emit different colors, enabling their use in display systems with improved efficiency and reliability.
Implementation Method 1
a bonding layer, formed at bottoms of the plurality of epitaxial layer slices and on a top surface of the driver circuit substrate, for bonding the micro-LEDs and the driver circuit substrate
Data Source
AI summary
A slicing micro-light emitting diode (LED) wafer includes a driver circuit substrate, a plurality of micro-LEDs formed on the driver circuit substrate, the plurality of micro-LEDs being made from a plurality of epitaxial layer slices arranged side-by-side on the driver circuit substrate, and a bonding layer, formed at bottoms of the plurality of epitaxial layer slices and on a top surface of the driver circuit substrate, for bonding the micro-LEDs and the driver circuit substrate.