Micro LED Display Wafer-Level Substrate Adhesive Layer
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Solution Overview
Problem
Conventional full-color LED display devices face limitations in color gamut and luminous efficiency due to the use of red, green, and blue LED chips, which restrict their ability to produce high-quality, full-color light effectively.
Innovation Solution
A micro LED display is manufactured using a wafer-level substrate with integrated control and ground circuits, an adhesive layer, a light-emitting assembly, and a conductive structure, where LED structures are fabricated on the adhesive layer and electrically connected to the control circuits via conductive layers, allowing for improved light emission and display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional red, green, and blue LED chips are used to create full-color LED display devices, then the display can produce full-color light, but the color gamut and luminous efficiency are limited
Solution Approach 1:
The invention segments the display into multiple sub-pixels, with each sub-pixel containing a specific color LED chip (red, green, or blue). This segmentation allows precise control over color emission and enables wider color gamut while maintaining high luminous efficiency through optimized individual chip performance
Solution Approach 2:
The patent applies local quality by assigning different color characteristics to different regions (sub-pixels) of the display. Each sub-pixel is optimized for its specific color function, with tailored LED chip selection and phosphor conversion layers to maximize luminous efficiency for that particular color while contributing to the overall wide color gamut
2Reliability
If wafer-level substrate with integrated circuits is used, then electrical connections are improved, but manufacturing complexity increases
Solution Approach 1:
The invention merges the control circuits and ground circuits directly into the wafer-level substrate, integrating multiple functional layers into a single unified structure. This integration improves electrical connection reliability by reducing interconnection points while the standardized wafer-level fabrication process manages manufacturing complexity through established semiconductor manufacturing techniques
Solution Approach 2:
The wafer-level substrate serves multiple functions simultaneously: it provides mechanical support, integrates control circuits for signal processing, incorporates ground circuits for electrical reference, and facilitates electrical connections to LED chips. This multi-functionality reduces the need for separate components and improves overall system reliability
3Manufacturing precision
If LED structures are disposed on adhesive layer separated from substrate, then display quality is improved, but manufacturing steps increase
Solution Approach 1:
The invention applies preliminary action by pre-attaching the LED structures to the adhesive layer in a separate preparation step before final mounting to the substrate. This preliminary attachment allows for precise positioning and quality control of LED structures, ensuring high display quality while the standardized adhesive layer facilitates relatively simple manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The micro LED display enhances color rendering and luminous efficiency by enabling precise electrical connections between LED structures and control circuits, resulting in improved image resolution and a larger displaying area.
Implementation Method 1
The adhesive layer is disposed on the wafer body
Implementation Method 2
Each of the LED structures has a first electrode terminal and a second electrode terminal
Implementation Method 3
The light-emitting assembly includes a plurality of LED structures disposed on the adhesive layer
Implementation Method 4
Each of the first conductive layers is electrically connected between the corresponding first electrode terminal and the corresponding conductive contact
Data Source
AI summary
A micro LED display and a method of manufacturing the same are provided. The micro LED display includes a wafer-level substrate, an adhesive layer, a light-emitting assembly, and a conductive structure. The wafer-level substrate includes a plurality of control circuits, wherein each control circuit has a conductive contact. The adhesive layer is disposed on the wafer-level substrate. The light emitting assembly includes a plurality of LED structures disposed on the adhesive layer. The conductive structure is electrically connected between the LED structures and the control circuits corresponding to each other. Thereby, the light-emitting assembly having the plurality of LED structures and the wafer-level substrate having the plurality of control circuits can be connected with each other via the adhesive layer.