Micro/Nanostructure Pad Connections for Stress-Tolerant Chip Packages
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Solution Overview
Problem
Conventional approaches face challenges in forming and handling component carriers, particularly in mounting electronic components, due to the need for mechanical robustness and electrical reliability under harsh conditions, especially with increasing miniaturization and complexity of component connections.
Innovation Solution
A package comprising a component carrier with a stack of electrically conductive and insulating layers, using micro- and/or nanostructures made of the same material as the carrier and component pads for electromechanical connection, providing elasticity and flexibility to balance mechanical and thermal stresses, and ensuring reliable electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mounting approaches are used for electronic components, then the component carrier can be assembled, but mechanical robustness and electrical reliability deteriorate under harsh conditions
Solution Approach 1:
The patent changes the physical parameters of the connection structure by using micro- and nanostructures instead of conventional bulk materials. This enables the connection to accommodate thermal expansion and mechanical stress through the flexible micro/nano-scale geometry while maintaining electrical conductivity, thus resolving the contradiction between reliability and mechanical strength under harsh conditions.
Solution Approach 2:
The patent employs composite material structures where micro- and nanostructures are integrated with the component carrier and electronic component. This composite approach combines the electrical conductivity of metal pads with the mechanical flexibility of micro/nanostructures, achieving both mechanical robustness and electrical reliability simultaneously.
2Adaptability or versatility
If the spacing between contacts is reduced to increase functionality, then more components can be connected, but manufacturing precision and alignment requirements worsen
Solution Approach 1:
The micro- and nanostructures provide dynamic compliance in the connection, allowing for self-adjustment during assembly. This dynamic property enables tolerant alignment even with reduced contact spacing, as the flexible micro/nanostructures can accommodate minor misalignments without requiring ultra-precise manufacturing.
Solution Approach 2:
The connection structure is segmented into multiple micro- and nanostructures rather than a single rigid connection. This segmentation distributes the alignment requirements across multiple smaller elements, reducing the cumulative precision demand while enabling higher component density and functionality.
3Reliability
If additional interposers are used to ensure alignment, then connection reliability improves, but device complexity and manufacturing steps increase
Solution Approach 1:
The micro- and nanostructures provide self-alignment and self-compensation capabilities during assembly. The flexible nature of these structures allows them to automatically adjust to accommodate misalignments between the component carrier and electronic component, eliminating the need for additional interposers or complex alignment mechanisms.
Solution Approach 2:
The patent extracts and eliminates the need for additional interposer layers by directly implementing the alignment and compensation function within the micro- and nanostructure connection itself. This simplification removes unnecessary structural complexity while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, reliable, and mechanically robust package that can withstand mechanical and thermal stresses, maintaining electrical integrity even with misalignment and varying pad sizes, without the need for additional interposers, thus improving connection reliability and simplifying the manufacturing process.
Implementation Method 1
providing elasticity and flexibility to balance mechanical and thermal stresses
Implementation Method 2
ensuring reliable electrical contact
Data Source
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AI summary
A package (100) which comprises a component carrier (102) having a stack (104) comprising at least one electrically conductive layer structure (106) and at least one electrically insulating layer structure (108), wherein the at least one electrically conductive layer structure (106) comprises at least one carrier pad (120), an electronic component (110) assembled with the component carrier (102) and comprising at least one component pad (122), and a connection structure (112) configured for electromechanically connecting the at least one carrier pad (120) with the at least one component pad (122) by micro- and/or nanostructures (114), wherein the micro- and/or nanostructures (114) are made of the same material as the at least one carrier pad (120) and/or the at least one component pad (122).