Micro-optoelectronic Component Alignment via Wafer Bonding
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Solution Overview
Problem
Existing miniaturized optoelectronic systems face challenges in accurately adjusting and integrating micro-optical elements with micro-electronic image sensors, particularly for light field photography, due to limited precision and complexity in aligning optical elements with sensor elements, which affects the accuracy of light incidence angles and image detection.
Innovation Solution
A method for manufacturing micro-optoelectronic components that enables precise lateral and vertical alignment of micro-optical elements with micro-electronic sensor arrays, achieving adjustments in the range of less than 1-2 microns and rotational errors of less than 0.5°, using wafer bonding techniques and optically structured glass wafers with silicon wafers, allowing for cost-effective mass production and integration of micro-optical elements with various optical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If discrete components with individual optical elements and precision mechanical adjustment devices are used, then adaptability of optical properties is improved, but manufacturing precision deteriorates due to limited adjustment accuracy of over 20 microns
Solution Approach 1:
The patent merges multiple discrete components into a single integrated semiconductor component. Multiple optical elements (lenses, mirrors, beam splitters) and sensor elements are fabricated together on the same semiconductor substrate, eliminating the need for separate mechanical adjustment devices. This integration achieves sub-micron alignment precision while maintaining the ability to use various optical properties through different micro-optical element designs.
2Volume of moving object
If miniaturization of optics and electronics is pursued, then area and thickness are reduced, but manufacturing precision deteriorates due to increased demands on adjustment accuracy
Solution Approach 1:
By integrating all optical elements and sensor elements on a single semiconductor substrate, the patent eliminates the need for post-fabrication mechanical adjustment. The monolithic integration ensures that all components are automatically aligned with sub-micron precision during the semiconductor manufacturing process, achieving both miniaturization and high alignment accuracy simultaneously.
Solution Approach 2:
The patent replaces mechanical adjustment devices with a semiconductor fabrication-based alignment system. Instead of using mechanical stages and adjustment mechanisms to achieve alignment, the invention uses photolithography and other semiconductor manufacturing techniques to precisely position all optical and sensor elements relative to each other during fabrication, achieving sub-micron precision without any mechanical adjustment.
3Manufacturing precision
If wafer bonding techniques are used for integration, then manufacturing precision is improved to less than 1-2 microns, but device complexity increases
Solution Approach 1:
The patent combines multiple fabrication approaches into a unified monolithic integration process. Rather than separately fabricating wafers and then bonding them together (which would increase complexity), the invention fabricates all optical elements and sensor elements in a single integrated semiconductor manufacturing process, achieving sub-micron precision through standard semiconductor techniques without requiring complex wafer bonding operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-precision, cost-effective production of micro-optoelectronic components for light field photography and other applications, improving light detection and image analysis with enhanced fill factor and reduced mechanical or electronic calibration needs, suitable for diverse fields including photography, biology, and environmental technology.
Implementation Method 1
Another approach to alignment and fixation is to use the shrinkage of a UV-curing (UV-Ultraviolet) adhesive for highly accurate position shifting.
Data Source
AI summary
A description is given of a method for producing a wafer stack comprising a multiplicity of micro-optoelectronic components, (100 - 400; 700), which method comprises the following steps: providing (1110) a first wafer, which comprises a semiconductor material; providing (1120) a second wafer, which comprises an optically transparent material; producing (1130) a multiplicity of light sensor arrangements (4A - 4C) in the semiconductor material (3a) of the first wafer (3) for each of the micro-optical components (100 - 400; 700) to be produced; patterning (1140) the second wafer (2) in such a way that a multiplicity of micro-optical elements (1A - 1C; 1A' - 1C) are formed therein for each of the micro-optoelectronic components to be produced; and producing (1150) a wafer stack (100 - 400; 700) by means of wafer bonding, said wafer stack having the first wafer (3, 3') and the second wafer (2) arranged thereabove, wherein each of the micro-optical elements is arranged and optically structured in such a way that different portions (9A - 9C, 10A - 10C) of the light incident on the micro-optical element are directed onto different light sensor elements (4a - 4e) of a light sensor arrangement (4A - 4C) arranged at least partly below said micro-optical element; and singulating (1190) the wafer stack in order to produce the multiplicity of micro-optoelectronic components (100 - 400; 700).