3D Curved Micro-Oscillator Rim Separation Without Flange

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Solution Overview

Problem

Current methods for manufacturing micro-oscillators with three-dimensional curved surfaces often result in a flange at the rim, which hinders vibration and film formation, leading to decreased Q-values and increased process complexity, including resin sealing and grinding, which can damage the glass substrate and reduce yield.

Innovation Solution

A method involving a substrate with a flat portion and a three-dimensional curved surface portion, where the outer surface of the curved portion is irradiated with a laser beam to separate the curved surface from the flat portion, eliminating the flange and simplifying the manufacturing process by avoiding resin sealing and grinding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional manufacturing methods are used to create three-dimensional curved surface micro-oscillators, then the curved surface structure is formed, but a flange is created at the rim that hinders vibration and film formation, decreasing Q-values

Engineering Contradiction:

Improvecurved surface structureVSAvoidQ-value

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent extracts and removes the harmful flange structure from the rim of the curved surface portion through laser beam irradiation. By selectively separating the curved surface portion from the flat portion, the flange that hinders vibration and film formation is eliminated, thereby improving Q-value while maintaining the curved surface structure.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces conventional mechanical separation methods (resin sealing and grinding) with laser beam irradiation. This substitution eliminates the need for mechanical contact that creates flanges, allowing clean separation of the curved surface portion without generating harmful structures that would decrease Q-value.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If resin sealing and grinding processes are used to remove the flange, then the flange is removed, but the glass substrate is damaged and yield is reduced

Engineering Contradiction:

Improveflange removalVSAvoidyield

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The patent replaces mechanical grinding and resin sealing processes with laser beam irradiation. The laser beam cleanly separates the curved surface portion from the flat portion without mechanical contact, eliminating substrate damage and improving yield while maintaining ease of flange removal.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical state and properties of materials through laser beam irradiation, using thermal energy to separate the curved surface portion. This parameter change approach allows precise control of the separation process without the mechanical forces that cause substrate damage in conventional methods.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If resin sealing and grinding processes are used to remove the flange, then the flange is removed, but the manufacturing process becomes more complex

Engineering Contradiction:

Improveflange removalVSAvoidmanufacturing process

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the need for multiple complex processes (resin sealing, grinding, alignment) by using laser beam irradiation to directly separate the curved surface portion. This single-step approach removes the flange without requiring additional manufacturing steps, thereby simplifying the overall process.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the flange removal function into the laser separation process itself. The same laser beam that separates the curved surface portion also removes the flange, combining multiple functions into a single operation and eliminating the need for separate resin sealing and grinding processes.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the production of micro-oscillators without a flange on the rim, improving yield and maintaining high Q-values by suppressing vibration hindrance and facilitating stable film formation, thus enhancing the sensitivity and reliability of the micro-oscillators.

Implementation Method 1

irradiating an outer surface of the curved surface portion with a laser beam to separate the curved surface portion from the flat portion

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS12121996B2Micro-oscillator, method of manufacturing micro-oscillator, and apparatus for processing micro-oscillator

Publication Date: 2024.10.22 DENSO CORP

AI summary

A method of manufacturing a micro-oscillator includes: preparing a substrate having a flat portion and a curved surface portion formed in a three-dimensional curved shape protruding from one surface of the flat portion, the curved surface portion being surrounded by the flat portion; and irradiating an outer surface of the curved surface portion with a laser beam to separate the curved surface portion from the flat portion.