Micro Pick-Up Array with Pivot Platform for Substrate Transfer
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Solution Overview
Problem
The commercialization of miniaturized devices such as RF MEMS microswitches, LED display systems, and quartz-based oscillators is hindered by the difficulties and costs associated with manufacturing processes, particularly in transferring micro devices from a carrier substrate to a receiving substrate, which often require multiple bonding and de-bonding steps and techniques like laser lift-off, grinding, or polishing.
Innovation Solution
A micro pick-up array with a self-aligning pivot platform and electrostatic transfer heads is used to transfer micro devices, allowing for uniform contact and alignment without the need for expensive fine-alignment sensors, utilizing a pivot platform that deflects to ensure complete and uniform contact during pick-up and release, and incorporating heating mechanisms for temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional transfer printing methods are used with multiple bonding and de-bonding steps, then micro devices can be transferred from carrier substrate to receiving substrate, but the process complexity and manufacturing cost increase significantly
Solution Approach 1:
The transfer process is segmented into distinct phases: pickup phase where the transfer wafer contacts the carrier substrate to acquire micro devices, and release phase where micro devices are transferred to the receiving substrate. This segmentation eliminates the need for complex multi-step bonding and de-bonding processes while maintaining transfer precision.
Solution Approach 2:
A transfer wafer acts as an intermediary carrier that temporarily holds micro devices during the transfer process. The transfer wafer with its array of transfer heads picks up micro devices from the carrier substrate and releases them onto the receiving substrate, simplifying the overall transfer mechanism without requiring multiple bonding cycles.
2Productivity
If laser lift-off, grinding, or polishing techniques are used for transfer wafer removal, then the transfer process can be completed, but the manufacturing cost and process difficulty increase
Solution Approach 1:
The transfer heads on the transfer wafer are designed to automatically release micro devices when specific conditions are met (such as voltage removal or mechanical actuation). This self-service mechanism eliminates the need for external laser lift-off, grinding, or polishing processes, significantly reducing manufacturing complexity and cost while maintaining high transfer completion rates.
3Measurement precision
If expensive fine-alignment sensors are used to ensure uniform contact during pick-up, then alignment precision improves, but manufacturing cost increases
Solution Approach 1:
The patent replaces complex mechanical alignment sensor systems with an electrostatic field-based alignment mechanism. The array of transfer heads uses electrostatic forces to achieve automatic alignment and uniform contact with micro devices during the pick-up process, eliminating the need for expensive fine-alignment sensors while maintaining high measurement precision.
4Manufacturing precision
If multiple bonding and de-bonding steps are used in transfer printing, then micro devices can be transferred, but the transfer time and process duration increase
Solution Approach 1:
The transfer process maintains continuous useful action through the use of a transfer wafer that remains in contact with micro devices throughout the transfer operation. The electrostatic field is continuously applied to hold and transfer micro devices from the carrier substrate to the receiving substrate in a single continuous motion, eliminating the time-consuming multiple bonding and de-bonding steps while preserving transfer accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the transfer process, reduces costs by eliminating the need for precise alignment tools, and enables high transfer rates of micro devices across various substrate sizes, ensuring efficient integration and assembly of micro devices into larger systems.
Implementation Method 1
An array of electrostatic transfer heads may be positioned over an array of micro devices carried on a carrier substrate. A voltage may be applied to the array of electrostatic transfer heads to create a grip pressure on the array of micro devices.
Implementation Method 2
The micro pick up array may include a heating contact on the base and a heating element over the pivot platform in electrical connection with the heating contact.
Data Source
AI summary
Systems and methods for transferring a micro device from a carrier substrate include, in an embodiment, a micro pick up array structure to allow the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array.