Micro-power Source Module with Integrated Capacitors for Noise Reduction

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Solution Overview

Problem

Current micro-power source modules for portable devices face challenges in achieving low-noise performance while minimizing occupied space and height, particularly in cell phones, due to limitations in ground inductance and noise reduction capabilities of existing designs.

Innovation Solution

A micro-power source module is designed with a divided inductor and integrated capacitors formed on the same semiconductor substrate, incorporating a T-type filter configuration to reduce noise, where noise absorption capacitors are placed adjacent to the power source IC, and the inductor has an intermediate tap connected to a ground terminal, allowing for reduced noise transmission and compact size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple discrete POL power sources are mounted on the printed circuit board, then each LSI can receive required power, but the occupied area and height increase significantly

Engineering Contradiction:

Improvepower supply reliabilityVSAvoidoccupied area on PCB

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent combines multiple POL power source functions into a single integrated module. The module includes a power source IC, multiple inductors with different inductance values, and capacitors all integrated on one PCB substrate, eliminating the need for multiple separate discrete power source components while maintaining reliable power supply to multiple LSIs

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated power source module serves multiple functions simultaneously - it provides power to multiple LSIs with different voltage requirements, includes noise filtering capabilities through integrated capacitors, and offers different inductance values for different current requirements, all within a single compact component

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If multiple discrete POL power sources are mounted on the printed circuit board, then each LSI can receive required power, but the height exceeds 1 mm

Engineering Contradiction:

Improvepower supply reliabilityVSAvoidmodule height

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a three-dimensional stacked arrangement of discrete components to a planar two-dimensional integration layout. By arranging the power source IC, inductors, and capacitors in a flat integrated structure on the PCB substrate, the height is reduced to under 1 mm while maintaining all necessary functional elements

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Device complexity

If conventional ground line connections are used, then the circuit is simple, but conduction noise increases due to ground inductance

Engineering Contradiction:

Improvecircuit simplicityVSAvoidconduction noise

Core Design Contradiction:

Device complexityVSObject-generated harmful factors

Solution Approach 1:

The patent introduces a dedicated ground terminal as an intermediary connection point between the power source IC and the external ground. This ground terminal is specifically designed to minimize ground inductance and serves as a common reference point for all power operations, effectively reducing conduction noise while maintaining circuit simplicity

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies local quality optimization by creating a specialized low-inductance ground connection path specifically for the power source IC. The ground terminal is positioned and configured to provide optimal ground reference quality for power switching operations, separating this critical function from general PCB ground traces

Inventive Principle:

Principle #3Local quality

4Object-generated harmful factors

If noise reduction components are added to the micro-power source module, then noise performance improves, but the occupied area increases

Engineering Contradiction:

Improvenoise levelVSAvoidmodule occupied area

Core Design Contradiction:

Object-generated harmful factorsVSArea of stationary object

Solution Approach 1:

The patent combines noise reduction components (capacitors) with the power source IC in an integrated layout. The capacitors are positioned adjacent to the power source IC and connected through minimal trace lengths, providing effective noise filtering while occupying minimal additional area within the same module footprint

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces conduction noise, achieves low-noise performance, and meets the stringent height and area requirements for cell phones by minimizing ground inductance and using small capacitance values, enhancing usability and manufacturing efficiency.

Implementation Method 1

an inductor (2)

Methodology Applied

Scientific EffectMagnetic energy storage: Inductor

Implementation Method 2

one or plural capacitors (4, 5)

Methodology Applied

Scientific EffectElectrical energy storage: Capacitance

Data Source

PatentUS7915759B2Micro-power source module

Publication Date: 2011.03.29 FUJI ELECTRIC CO LTD

AI summary

A power source IC and noise absorption capacitors (decoupling capacitors) are formed on an inductor in such a manner that the noise absorption capacitors are provided on the input side and the output side, respectively. A micro-power source module can thus be provided which is small in occupied area and height and can reduce conduction noise due to ground lines.