Integrated Micro-Shielding Structure for RF EMI Reduction
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Solution Overview
Problem
The integration of RF and digital or analog control circuits in semiconductor devices is hindered by electromagnetic interference (EMI), particularly in high-frequency applications, where conventional external shielding methods increase costs and complexity while failing to effectively reduce EMI between components.
Innovation Solution
An integrated micro-shielding structure is formed within the semiconductor device, extending vertically through the substrate between the front and back surfaces to surround functional circuits, reducing RF emissions and coupling between components, thereby providing effective EMI shielding without the need for external shielding cans or complex packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If external shielding cans or complex packaging are used to reduce EMI, then EMI reduction is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the shielding function with the substrate structure by forming conductive shielding patterns directly on the substrate surface using standard PCB fabrication techniques. This integration eliminates the need for separate external shielding cans and complex packaging structures, thereby reducing device complexity while maintaining EMI reduction effectiveness.
Solution Approach 2:
The substrate itself provides the shielding function through integrated conductive patterns, eliminating the need for additional external shielding components. The substrate serves dual purposes: as the structural base and as the EMI shielding element, thereby simplifying the overall device structure and reducing manufacturing complexity.
2Object-affected harmful factors
If external shielding cans or complex packaging are used to reduce EMI, then EMI reduction is improved, but manufacturing cost increases
Solution Approach 1:
The shielding function is merged with the substrate fabrication process, allowing EMI protection to be achieved during standard PCB manufacturing without requiring additional external shielding components. This integration significantly reduces manufacturing cost by eliminating separate shielding can assembly steps and associated labor costs.
Solution Approach 2:
The substrate provides its own shielding capability through integrated conductive patterns, eliminating the need for expensive external shielding components and their associated assembly processes. This self-shielding approach reduces manufacturing cost while maintaining effective EMI reduction.
3Object-affected harmful factors
If devices are physically separated and housed in different shielded packages, then EMI reduction is improved, but space consumption and assembly complexity increase
Solution Approach 1:
Multiple functional circuits that would traditionally require separate shielded packages are merged onto a single substrate with integrated shielding patterns. This consolidation reduces the overall space consumption while the substrate-level shielding maintains EMI reduction effectiveness, eliminating the need for multiple discrete shielded packages.
4Object-affected harmful factors
If external conductive layers are employed over die or packages, then EMI reduction is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The shielding function is merged into the substrate fabrication process itself, using standard PCB techniques to create conductive shielding patterns directly on the substrate. This approach eliminates the need for separate external conductive layers and their associated complex manufacturing processes, thereby reducing manufacturing process complexity while maintaining EMI reduction effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the integration of multiple RF components on the same die, improves high-frequency performance, and reduces EMI effectively, while minimizing cost and complexity, allowing for more efficient heat transfer and integration in chip-scale packaging.
Implementation Method 1
an integrated micro-shielding structure formed in the semiconductor device. The micro-shielding structure extends vertically through the substrate between a front surface and a back surface of the substrate and surrounds the one or more functional circuits
Data Source
AI summary
A method of reducing electromagnetic interference in a semiconductor device includes: forming at least one functional circuit in a substrate of the semiconductor device; forming an integrated micro-shielding structure in the semiconductor device, the micro-shielding structure extending vertically through the substrate between a front surface and a back surface of the substrate and surrounding the functional circuit, the micro-shielding structure being configured to reduce radio frequency (RF) emissions in the semiconductor device and/or RF coupling between different functional parts of the functional circuit.