Programmable Micro-Stamp Array for Non-Planar Die Transfer
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Solution Overview
Problem
Conventional micro-stamp pick-and-place technologies are limited by high fabrication costs, material customization requirements, organic contamination, low yield, and inability to handle dies with non-planar surfaces or replace defective dies efficiently.
Innovation Solution
A programmable micro-stamp pick-and-place apparatus and method using fluidically interconnected micro-stamps with soft micropillars, enabling flexible reprogramming and adhesion forces for precise handling of dies on various substrates, including non-planar surfaces, and allowing for efficient die replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If elastomeric stamps are customized for each die material, size and pitch layout, then transfer precision is improved, but micro-stamp fabrication cost increases
Solution Approach 1:
The elastomeric stamp is divided into multiple independently controllable micro-stamps, each capable of being actuated separately. This segmentation allows selective activation of only the micro-stamps needed for a particular die transfer operation, reducing the need for custom fabrication of entire stamp arrays for different die configurations.
Solution Approach 2:
The system employs dynamically controllable micro-stamps that can be selectively actuated based on real-time requirements. The micro-stamps can be individually activated or deactivated through electrical signals, allowing the same physical stamp structure to adapt to different die materials, sizes and pitch layouts without requiring physical reconfiguration or refabrication.
2Productivity
If laser beam assisted elastomeric stamping is used to release dies, then transfer speed is improved, but organic contamination on dies increases
Solution Approach 1:
The system replaces laser-based release mechanisms with an electrical actuation system that uses voltage-controlled adhesion forces to release dies. This substitution eliminates the need for laser beams, thereby preventing organic contamination while maintaining efficient die transfer speeds through electrical control of the elastomeric micro-stamp adhesion properties.
3Extent of automation
If electromagnetic method is used for die transfer, then automation level is improved, but yield decreases due to die-missing and electro-static discharging
Solution Approach 1:
The system changes the physical parameters of the transfer mechanism by using controlled electrical adhesion forces instead of strong electromagnetic fields. By precisely controlling the voltage applied to micro-stamps, the system achieves gentle die release that prevents electro-static discharging and die-missing, thereby improving yield while maintaining high automation through electrical control.
4Device complexity
If conventional vacuum nozzles are used for pick-and-place, then device simplicity is maintained, but handling capability for non-planar surfaces and small dies is limited
Solution Approach 1:
The system uses flexible elastomeric micro-stamps instead of rigid vacuum nozzles. The elastomeric material can conform to non-planar die surfaces and flexible substrates, enabling handling of dies with varying topographies and small sizes while maintaining relatively simple device architecture through the use of compliant materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables low-cost, high-yield, and versatile die placement on flexible or curved substrates, reducing fabrication and operating costs while improving process throughput and die handling precision.
Implementation Method 1
A micro-stamp device having an array or pattern of micropillars arranged in a grid pattern and extending from a substantially planar surface
Implementation Method 2
a patterned polymer membrane bonded to the front face of the micro-stamp body, wherein a plurality of soft micropillars are formed by a self-aligned process from the patterned polymer membrane
Data Source
AI summary
The present invention describes an innovative programmable micro-stamp pick and place apparatus and method. This invention provides a micro-stamp device having a patterned polymer membrane that is configured with micropillars. When a micro-stamp device, singly or arranged in an array or group, is inflated with a fluid, the patterned polymer membrane deforms from a planar state and this causes the micropillars to peel from the workpiece. This patterned polymer membrane can thus be used to pick and place electronic die(s) or chip(s), single or in an array or a group, during fabrication, or to pick and replace defective die(s) or chip(s) during a test and repair process.