Micro-Channel Heat Dissipation Structure for IC Package Cooling
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Solution Overview
Problem
The challenge in the semiconductor industry is to effectively dissipate heat generated by integrated circuit devices as they become smaller and more densely packed, which traditional packaging techniques struggle to address efficiently.
Innovation Solution
A heat dissipation structure with micro-channels is integrated into the package, allowing a cooling fluid to flow through and dissipate heat generated by the integrated circuit die, utilizing a bulk substrate with embedded strips that are etched and removed to form channels for efficient heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional packaging techniques are used for densely packed semiconductor devices, then manufacturing simplicity is maintained, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat dissipation structure is segmented into multiple micro-channels within the bulk substrate, dividing the heat dissipation function into distributed pathways that efficiently conduct heat away from densely packed semiconductor devices without requiring a completely new packaging architecture
Solution Approach 2:
The micro-channels are embedded within the bulk substrate, creating a nested structure where the cooling channels are integrated inside the existing substrate geometry. This allows heat dissipation functionality to be embedded within the packaging structure itself, improving thermal management without significantly increasing external package complexity
2Temperature
If micro-channels are added to the heat dissipation structure, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The micro-channels are formed within the bulk substrate before the semiconductor devices are mounted. This preliminary formation of cooling channels allows subsequent device attachment and encapsulation to proceed without additional channel creation steps, simplifying the overall manufacturing process despite the added thermal management functionality
3Productivity
If semiconductor devices are shrunk and densely packed, then integration density is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The bulk substrate provides localized heat dissipation pathways directly beneath each semiconductor device through the micro-channel network. This local heat removal capability allows devices to be densely packed without compromising thermal management, as each device has dedicated cooling channels in its immediate vicinity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation efficiency by effectively conducting heat away from the integrated circuit devices through flowing cooling fluid, improving thermal management in densely packed semiconductor packages.
Implementation Method 1
The heat dissipation structure may include a plurality of micro-channels recessed from its top surface, which may allow a cooling fluid to flow through and therefore can effectively dissipate heat generated by the integrated circuit die
Data Source
AI summary
In an embodiment, a package includes an interposer; a first integrated circuit device attached to the interposer, wherein the first integrated circuit device includes a die and a heat dissipation structure, the die having an active surface facing the interposer and an inactive surface opposite to the active surface, the heat dissipation structure attached to the inactive surface of the die and including a plurality of channels recessed from a first surface of the heat dissipation structure, the first surface of the heat dissipation structure facing away from the die; and an encapsulant disposed on the interposer and laterally around the die and the heat dissipation structure, wherein a top surface of the encapsulant is coplanar with the top surface of the heat dissipation structure.