Microchip Charge Patterning via Localized Agents

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Solution Overview

Problem

Current techniques fail to effectively deposit charge patterns on isolated microchips, leading to issues such as chip attraction and instability, and lack scalability and cost compatibility with existing manufacturing processes.

Innovation Solution

The method involves depositing charge patterning materials on microchips using techniques like solution processing, vapor deposition, and photolithography, with the use of charge control agents and non-polar fluids to generate and stabilize charge patterns, allowing for varying magnitudes and polarities, and using devices like scorotron and corotron for charging, ensuring compatibility with semiconductor fabrication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If charge is deposited on microchips using conventional techniques, then charge patterns can be formed, but the chips are attracted to each other and congregate based on their charges

Engineering Contradiction:
Improvecharge pattern depositionVSAvoidchip attraction and congregation
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent applies local quality by creating specific charge patterns at defined locations on the microchip surface rather than uniform charging. The charge control agent is deposited in specific patterns (e.g., at corners or edges) to create localized charge regions that enable precise positioning without causing overall chip attraction and congregation.

Inventive Principle:
Principle #3Local quality

2Measurement precision

If charge density is increased to improve positioning accuracy, then positioning precision improves, but chip stability decreases due to increased attraction between chips

Engineering Contradiction:
Improvepositioning accuracyVSAvoidchip stability
Core Design Contradiction:
Measurement precisionVSStability of the object's composition

Solution Approach 1:

By concentrating charge control agent in specific localized patterns rather than distributing it uniformly, the patent achieves high positioning precision through localized charge fields while minimizing overall chip attraction. The localized charge regions provide sufficient signal for accurate positioning without creating strong global attractive forces between chips.

Inventive Principle:
Principle #3Local quality

3Reliability

If conventional charge deposition methods are used, then charging can be achieved, but the process is not scalable to manufacturing levels

Engineering Contradiction:
Improvecharging effectivenessVSAvoidmanufacturing scalability
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent replaces complex mechanical charge deposition systems with a chemical approach using charge control agents that can be deposited using standard semiconductor manufacturing techniques such as spin coating, dip coating, or spray coating. This substitution enables scalable manufacturing while maintaining reliable charge pattern formation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental parameter of charge deposition from direct electrical charging to chemical deposition of charge control agents. This parameter change allows the use of established semiconductor manufacturing processes, enabling scalable production while maintaining effective charge pattern formation through controlled chemical deposition parameters.

Inventive Principle:
Principle #35Parameter changes

4Adaptability or versatility

If charge patterns are deposited to enable chip identification, then chip control and identification improve, but manufacturing costs increase

Engineering Contradiction:
Improvechip control and identificationVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The charge control agent serves multiple functions: it provides charge for identification and positioning, acts as a patternable material using existing lithography tools, and can be deposited using standard semiconductor manufacturing processes. This multi-functionality enables chip control and identification capabilities while utilizing existing manufacturing infrastructure, thereby avoiding additional cost increases.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables stable and scalable charge patterning on microchips, preventing attraction and maintaining low chip density, while being compatible with existing manufacturing processes and allowing for long-term shelf life and flexible control.

Implementation Method 1

a charge control agent that is capable of carrying charge in a non-polar liquid

Methodology Applied
Scientific EffectElectrostatic induction: Electrostatic Induction

Implementation Method 2

The deposited material is then charged using, for example, a scorotron or corotron

Methodology Applied
Scientific EffectCorona discharge: Corona Discharge

Data Source

PatentUS11574876B2Microchip charge patterning
Publication Date: 2023.02.07 GENESEE VALLEY INNOVATIONS LLC
  • US11574876B2 patent drawing
  • US11574876B2 patent drawing
  • US11574876B2 patent drawing

AI summary

A method of forming a charge pattern on a microchip includes depositing a material on the surface of the microchip, and immersing the microchip in a fluid to develop charge in or on the material through interaction with the surrounding fluid.