Microchip With Dual-Surface Pads For Display Aperture Ratio
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Solution Overview
Problem
In organic light emitting display apparatuses, the high number of TFTs required for driving pixels reduces the aperture ratio due to space constraints, as many TFTs are needed to manage light emission effectively, leading to a compromise in display quality.
Innovation Solution
A display apparatus design that incorporates a microchip with pad parts on both surfaces, allowing for efficient connection to multiple scan and data lines, enabling a single microchip to drive six or more pixels, thereby reducing the physical space required for TFTs and enhancing the aperture ratio.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large number of TFTs are used for driving one pixel, then display quality is improved, but the aperture ratio is reduced due to space constraints
Solution Approach 1:
Multiple TFTs (switching TFT, driving TFT, and compensation TFTs) that were traditionally placed separately on the substrate are merged into a single microchip. This integration allows all necessary TFTs for high-quality display to be contained in one compact unit, eliminating the need for separate TFT placements and associated wiring spaces on the substrate, thereby increasing the aperture ratio while maintaining display quality.
Solution Approach 2:
The invention transitions from a planar arrangement of TFTs on the substrate to a three-dimensional integrated structure within the microchip. By stacking and integrating multiple TFT layers vertically within the microchip volume, the design accommodates more TFTs without increasing the lateral footprint on the substrate, thus preserving aperture ratio while enabling complex pixel driving functionality.
2Area of stationary object
If multiple TFTs are integrated into a microchip, then the aperture ratio is improved, but the connection complexity increases
Solution Approach 1:
The complex network of TFTs and their interconnections are extracted from the substrate level and relocated into the microchip. This extraction consolidates all connection complexity within the microchip's internal structure, leaving only simplified external connections to the substrate, thereby reducing overall connection complexity while maintaining high aperture ratio.
Solution Approach 2:
Multiple TFTs and their interconnections are nested within the microchip structure, with smaller components housed within larger ones. This nested arrangement efficiently packs complex connectivity into a compact volume, managing internal connection complexity while presenting a simplified external interface to the substrate.
3Quantity of substance
If pad parts are provided on both surfaces of the microchip, then the number of connection pads increases, but the manufacturing process becomes more complex
Solution Approach 1:
The connection pads are segmented and distributed across both surfaces of the microchip rather than concentrated on one side. This segmentation allows for more efficient routing of connections from different directions, reducing the need for long internal interconnects and simplifying the overall manufacturing process despite the dual-surface configuration.
Solution Approach 2:
The connection pad arrangement transitions from a two-dimensional layout on a single surface to a three-dimensional configuration utilizing both surfaces of the microchip. This spatial redistribution optimizes connection routing by allowing inputs and outputs to access pads from opposite sides, reducing internal wire length and manufacturing complexity.
Data Source
AI summary
Disclosed is a display apparatus. The display apparatus includes a substrate, a first wiring part on the substrate, a first insulation layer on the first wiring part, a microchip on the first insulation layer, a second wiring part on the microchip, and an organic light emitting device on the second wiring part. The microchip includes a first surface and a second surface opposite to each other, a first pad part on the first surface, and a second pad part on the second surface. The first pad part is connected to the first wiring part, and the second pad part is connected to the second wiring part.