Microdevice Substrate Integration With Patterned Reflectors
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Solution Overview
Problem
The challenge lies in efficiently integrating millions of microdevices with circuits for every pixel with proper yield, as existing methods are costly, require large equipment, and face issues with structural non-uniformity and bonding repeatability.
Innovation Solution
The integration involves sandwiching light sources between two reflective layers, with at least one patterned for improved light output uniformity, and using transfer technologies like electrostatic or direct transfer mechanisms, along with deposition and lamination processes to connect microdevices to integrated circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional integration methods are used to transfer millions of microdevices, then integration capability is achieved, but cost increases and productivity decreases due to large equipment requirements and complex processes
Solution Approach 1:
The patent segments the integration process into distinct stages: microdevice fabrication on donor substrates, pattern formation on receiver substrates, and transfer operations. This segmentation allows each stage to be optimized independently, reducing overall cost and improving efficiency by eliminating the need for single large-scale equipment
Solution Approach 2:
The patent introduces patterned receiver substrates as intermediaries that facilitate the transfer process. These substrates with pre-formed patterns enable precise positioning and integration of microdevices, improving transfer efficiency while reducing costs through standardized intermediary components
2Reliability
If microdevices are integrated with circuits for every pixel, then system performance improves, but manufacturing precision decreases due to structural non-uniformity and bonding repeatability issues
Solution Approach 1:
The patent applies preliminary actions by forming patterns on receiver substrates before microdevice transfer. This pre-patternning ensures precise alignment and positioning, improving bonding repeatability and manufacturing precision before the actual integration occurs
Solution Approach 2:
The patent implements local quality by creating specific patterns at specific locations on receiver substrates. Each pattern is tailored to its local requirements, ensuring optimal bonding and electrical connection for each pixel location, thereby maintaining high manufacturing precision across the entire array
3Device complexity
If light sources are integrated without patterned reflective layers, then device complexity is reduced, but illumination intensity uniformity worsens
Solution Approach 1:
The patent applies local quality by implementing patterned reflective layers with spatially varying properties. The patterns are designed to compensate for local variations in light extraction, ensuring uniform illumination intensity across the entire light source array while maintaining manageable device complexity through systematic patterning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances light output uniformity and reduces integration costs by optimizing the transfer and bonding processes, ensuring high yield and reliability of microdevice integration.
Implementation Method 1
pick and place with different mechanisms, e.g. electrostatic transfer head
Implementation Method 2
light sources sandwiched between two reflective layers with at least one patterned reflective layer
Data Source
AI summary
An integrated optical display system includes a backplane with appropriate electronics, and an array of micro-devices. A touch sensing structure may be integrated into the system. In one embodiment, an integrated circuit and system is integrated on top of micro-devices transferred to a substrate. Openings in a planarization layer (or layers) may be provided to connect the micro-devices with electrodes and other circuitry. Light reflectors may be used to redirect the light, and color conversion layers or color filters may be integrated before the micro-devices or on the substrate surface opposite to the surface of micro-devices.