Microdevice Cartridge Pitch Mapping With Stretch Compensation
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Solution Overview
Problem
Microdevices with smaller pitches on donor substrates cannot be efficiently transferred to system substrates with larger pitches due to mismatched dimensions, resulting in a high number of transfer cycles and potential damage during stretching.
Innovation Solution
The method involves stretching the donor substrate to increase microdevice pitch before transfer, using pillars or grooves to minimize damage, and potentially transferring through temporary substrates to align with the system substrate pitch, allowing for more devices to be transferred in fewer cycles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the donor substrate is stretched to increase microdevice pitch before transfer, then the number of microdevices transferred per cycle increases, but stress and potential damage to the microdevices occur
Solution Approach 1:
The donor substrate is stretched to increase the microdevice pitch before the transfer process begins. This preliminary action allows more microdevices to be transferred in each cycle by pre-adjusting the pitch to better match the system substrate pitch, thereby improving productivity while controlling the stretching amount to minimize damage
Solution Approach 2:
The pitch of the microdevices on the donor substrate is changed by stretching the substrate. This parameter change increases the distance between microdevices, allowing a higher number of devices to be transferred per cycle. The stretching amount is controlled to balance productivity improvement with microdevice integrity
2Quantity of substance
If multiple transfer cycles are used to transfer microdevices with mismatched pitches, then all microdevices can be transferred, but the number of transfer cycles increases and processing time extends
Solution Approach 1:
The donor substrate pitch is pre-adjusted through stretching to better match the system substrate pitch before transfer. This preliminary pitch adjustment enables a larger portion of microdevices to be transferred in each cycle, reducing the total number of transfer cycles required and thereby reducing processing time while ensuring complete transfer of all microdevices
3Productivity
If the microdevice pitch on the donor substrate is increased by stretching, then fewer transfer cycles are needed, but the stress on the substrate and microdevices increases
Solution Approach 1:
The pitch parameter of the microdevices is changed by stretching the donor substrate. This parameter change reduces the pitch difference between donor and system substrates, thereby reducing the number of transfer cycles needed. The stretching is controlled to achieve the necessary pitch adjustment while managing the stress applied to the substrate and microdevices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of transfer cycles, increases the number of microdevices transferred per cycle, and minimizes stress on the substrates, ensuring the integrity and uniformity of the microdevices during the stretching process.
Implementation Method 1
adjusting a pitch difference between the donor substrate and system substrate by stretching
Implementation Method 2
having pillars on the donor substrate where microdevices sit on the pillars, adjusting a pitch of the microdevices in the donor substrate by stretching the donor substrate prior to transferring microdevices to a system substrate, reducing the impact of stretching on the microdevices through the pillar
Data Source
AI summary
This disclosure is related to transfer of microdevices from a donor substrate to a system or temporary substrate where a pitch between microdevices is adjusted by stretching the substrate before or after the transfer. Further, methods are disclosed to protect the electronic components by use of stretchable pillars and grooves. In addition, a sandwich configuration with a sheeting process is also considered.