Method for collectively bending microelectronic components, including transferring the assembled microelectronic components with a temporary handle
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Solution Overview
Problem
Existing methods for collectively bending microelectronic components often result in curvatures that do not accurately match the desired curvature, affecting the optical performance of optoelectronic components such as optical detectors or emitters.
Innovation Solution
A method involving the production of an initial structure with microelectronic components and a temporary handle substrate, followed by deposition of an adhesive interlayer, transfer to a shaping support with curved surfaces, removal of the handle substrate, and curvature of the components to adhere to the shaping support, ensuring precise curvature and electrical interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If microelectronic components are collectively bent using conventional methods, then productivity is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent introduces a temporary handle substrate as an intermediary carrier that enables collective manipulation and bending of multiple microelectronic components simultaneously. This handle substrate acts as a mediator between the bending apparatus and the components, allowing uniform force distribution across all components while maintaining individual curvature precision through the adhesive layer interface.
Solution Approach 2:
The patent segments the bending process into distinct stages: initial collective attachment to the handle substrate, individual curvature application through the shaping support, and subsequent separation. This segmentation allows the system to achieve both collective processing efficiency and individual component precision by treating the group and individual components at different process stages.
2Ease of operation
If a temporary handle substrate is used for collective transfer, then ease of operation is improved, but device complexity increases
Solution Approach 1:
The patent extracts the handling and manipulation functions into a separate temporary handle substrate that is not part of the final product structure. This extracted handle substrate承担了 all the complex manipulation tasks during manufacturing, then is cleanly removed before final assembly, leaving only the essential curvature modification in the final product.
Solution Approach 2:
The temporary handle substrate is used temporarily during the manufacturing process to enable collective operations, then deliberately discarded (removed) before final product assembly. This approach allows the system to benefit from the handle substrate's structural and manipulative properties during manufacturing without carrying its complexity into the final product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for microelectronic components to be curved accurately, improving their optical performance by achieving the desired curvature and ensuring reliable electrical connections, while maintaining mechanical properties.
Implementation Method 1
deposition of an adhesive interlayer covering the lower face of the microelectronic components or the upper face of the shaping support
Data Source
Figure 1A~1C
Figure 1D~1F
Figure 1G~1I
AI summary
The invention relates to a method for collectively bending microelectronic components (10), including transferring an initial structure (1) comprising a temporary handle (7) and a plurality of microelectronic components (10) onto a shaping medium (20), and subsequently removing the temporary handle (7), and bending the microelectronic components (10) such that they are curved and adhere, with an adhesive layer (6), to the curved surfaces (21) of the shaping medium (20).