Microelectronic Device Protected Connections Protection Ring

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Solution Overview

Problem

Existing microelectronic device protection methods face challenges such as material incompatibility, damage under environmental stress, and interference with functional regions, particularly in harsh conditions like high pressures or fluid exposure.

Innovation Solution

A microelectronic device design featuring a chip with protected connections and a substrate, where protection rings surround electrical contact regions, forming a composite ring that mechanically and chemically protects the connections, allowing for traditional protection materials to be used without compromising operation, and includes a degassing hole for controlled atmosphere bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional protection materials (epoxy resin, moulding compound, potting gel) are applied to protect wire bonding connections, then mechanical and chemical protection is improved, but the materials may spread out and cover functional parts of the device, interfering with operation

Engineering Contradiction:

Improveprotection of wire bonding connectionsVSAvoidoperation of functional parts

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The device is divided into distinct functional zones: a first region containing the chip and its functional parts, and a second region containing the connection terminals. The protection material is applied only in the second region, physically segmented from the functional parts in the first region, thus providing protection without interfering with device operation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The connection terminals are extracted and positioned in a separate region remote from the chip's functional parts. This spatial extraction allows the protection material to be applied locally at the connection terminals without the risk of spreading to and interfering with the functional parts of the device.

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If protection materials are applied to protect wire bonding connections, then mechanical protection is improved, but the materials may not be chemically compatible with the external environment, causing damage and loss of protection

Engineering Contradiction:

Improveprotection of wire bonding connectionsVSAvoidchemical incompatibility with external environment

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A barrier layer is introduced as an intermediary between the protection material and the external environment (including brake fluid). This barrier layer, formed by depositing material such as parylene, silicon oxide, or silicon nitride, provides chemical compatibility and prevents direct contact between the protection material and harmful external substances, thus maintaining long-term protection.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If protection materials are applied to protect wire bonding connections, then mechanical protection is improved, but under high pressure conditions the materials may deteriorate and no longer ensure protection

Engineering Contradiction:

Improveprotection of wire bonding connectionsVSAvoidresistance to high pressure

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The protection system uses a composite structure combining multiple materials with complementary properties: a barrier layer (parylene, silicon oxide, or silicon nitride) provides chemical inertness and pressure resistance, while the protection material (epoxy resin, moulding compound, or potting gel) provides mechanical protection. This composite approach ensures protection under high pressure conditions where single materials would deteriorate.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS10615142B2Microelectronic device having protected connections and manufacturing process thereof

Publication Date: 2020.04.07 STMICROELECTRONICS SRL

AI summary

A microelectronic device includes a chip housing a functional part and carrying first electrical contact regions in electrical connection with the functional part through first protected connections extending over or in the chip. A substrate has a first contact area and a second contact area, which is remote from the first contact area. The first contact area carries second electrical contact regions, and the second contact area carries external connection regions. The second contact regions and the external connection regions are in mutual electrical connection through second protected connections extending over or in the substrate. A protection-ring structure surrounds the first and second electrical contact regions and delimits a first chamber closed with respect to the outside. The first electrical contact regions and the second electrical contact regions are in mutual electrical contact.