Laser Projection Mass Transfer With Blister Release for MicroLED Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current mass transfer technologies for MicroLEDs face challenges in achieving high reliability, precision, and efficiency due to issues such as low yield, high cost, low precision, and slow speed, particularly related to light spot alignment, adhesion, driving force, substrate spacing, and response time, which hinder the commercialization of MicroLED displays.
Innovation Solution
A laser projection proximity mass transfer device and method are introduced, featuring a laser module, laser mask projection optical path module, and vision module, with a dynamic release layer and adhesive foam layer, which uses laser ablation to generate blisters and reduce adhesion, enabling precise and efficient transfer of MicroLEDs by controlling the blister formation and interface adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser-induced forward transfer (LIFT) technology is used to achieve chip transfer by ablating the shock wave generated by the sacrificial layer, then transfer speed is improved, but chip breakage increases due to shock wave affecting the flight path
Solution Approach 1:
The patent introduces a blister layer as an intermediary between the sacrificial layer and the chip. The blister layer absorbs and mitigates the shock wave generated during laser ablation, preventing direct transmission of harmful shock waves to the chip while maintaining the transfer speed benefits of LIFT technology
Solution Approach 2:
The patent pre-establishes a protective structure (blister layer) before the transfer process to cushion and absorb the harmful shock waves that will be generated during laser ablation, thereby preventing chip breakage before it can occur
2Productivity
If patterned laser spots are used to achieve array and batch transfer of MicroLEDs, then transfer efficiency is improved, but transfer accuracy decreases due to various parameters affecting positioning
Solution Approach 1:
The patent replaces mechanical alignment methods with a vision system that uses optical fields to detect and locate chips. The vision system captures images of the chip array and determines precise positions through image processing, eliminating mechanical positioning errors
Solution Approach 2:
The patent creates an optical copy (image) of the chip array using the vision system, allowing digital measurement and positioning without physical contact. The coordinate system transformation is performed on the digital image data to achieve precise positioning
3Manufacturing precision
If magnetic-driven chip self-alignment process is used to improve accuracy, then positioning precision is improved, but device complexity increases due to magnetization layer requirements
Solution Approach 1:
The patent replaces the magnetic field-based self-alignment mechanism with a vision system that uses optical fields for detection and positioning. This eliminates the need for magnetization layers and magnetic actuators, reducing device complexity while maintaining positioning precision
4Device complexity
If optical mask is used for laser spot patterning, then device complexity is reduced, but adjustment difficulty increases due to sealed optical path
Solution Approach 1:
The patent transforms the static, sealed optical mask system into a dynamic, adjustable vision system. The vision system allows real-time modification of optical paths and parameters without physical reconfiguration, enabling flexible adjustment while maintaining system simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves MicroLED transfer precision and efficiency, reduces chip breakage, and enhances yield by ensuring accurate alignment and weak contact with the receiving substrate, addressing the limitations of existing technologies.
Implementation Method 1
the dynamic release layer is ablated to generate ablation gas, thereby causing the dynamic release layer to generate blister
Implementation Method 2
Under the action of the laser, the dynamic release layer is ablated to generate ablation gas
Implementation Method 3
the foamed particles inside the adhesive foam layer expand, reducing the adhesion of the adhesive foam layer
Implementation Method 4
Under the action of thermal stimulation or laser, the foamed particles inside the adhesive foam layer expand
Data Source
AI summary
The disclosure belongs to the field of MicroLED, and discloses a projection proximity mass transfer device. The device includes a support layer, a dynamic release layer and a adhesive foam layer. The support layer is a base layer; the dynamic release layer is arranged on the support layer. Under laser radiation, the dynamic release layer is ablated to generate ablation gas, thereby causing the dynamic release layer to generate blister; the adhesive foam layer is arranged on the dynamic release layer, and the foam layer is in contact with the MicroLED to be transferred. Under the action of thermal stimulation or laser, the foamed particles inside the adhesive foam layer expand, reducing the adhesion of the foam layer. Thereby, blisters with microstructures are formed at the interface between the stamp and the chip, thus realizing peeling of the MicroLED to be transferred.