Micro-LED Bonding Assembly With Insert-Fit Electrodes for Easy Repair
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Solution Overview
Problem
The conventional bonding process for micro-LED display backplanes is challenging due to the difficulty in repairing defective points without affecting the quality of surrounding solder joints, leading to high repair costs and complexity.
Innovation Solution
A bonding assembly comprising a microelectronic component and a bonding backplane, where an accommodation fixing structure on one component is inserted and fixed by an insertion structure on the other, allowing for electrical connection without heating or welding, thereby simplifying the repair process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heating and welding methods are used to bond chips to the backplane, then electrical connection is achieved, but the quality of surrounding solder joints is affected and repair complexity increases
Solution Approach 1:
The bonding assembly is segmented into distinct components: a microelectronic component with chip electrodes and a bonding backplane with substrate electrodes. The accommodation fixing structure is further segmented into multiple first nanorods with gaps between them, allowing the insertion structure (second nanorods) to be individually positioned and bonded without affecting surrounding areas. This segmentation enables localized repair operations.
Solution Approach 2:
The patent implements local quality by providing accommodation fixing structures and insertion structures at specific locations where bonding is needed. The first nanorods are arranged spaced apart from each other, creating localized bonding zones. This allows repair operations to be performed locally without heating or affecting the entire backplane, thus preserving the quality of surrounding solder joints.
2Ease of repair
If laser removal and chip replacement is performed for defective points, then repair is achieved, but repair costs increase and surrounding solder joints may be damaged
Solution Approach 1:
The accommodation fixing structure with first nanorods and the insertion structure with second nanorods are pre-configured during manufacturing. The gaps between first nanorods are designed to match the width of second nanorods, and bonding surfaces are prepared in advance. This preliminary preparation simplifies the repair process, as defective chips can be replaced by simply inserting new components into the pre-configured structures without requiring complex laser removal or re-bonding procedures.
3Productivity
If massive number of micro-LED chips are transferred and bonded to the backplane, then display functionality is achieved, but repair difficulty increases
Solution Approach 1:
The patent uses standardized accommodation fixing structures and insertion structures that can be replicated across the backplane. The first nanorods and second nanorods serve as copyable templates that can be manufactured in large numbers with consistent dimensions. This standardization allows for efficient mass production of the bonding assembly while simultaneously simplifying repair operations, as replacement components can be easily obtained and installed using the same standardized interfaces.
Data Source
AI summary
A bonding assembly includes: a microelectronic element; a bonding substrate; a chip electrode arranged on a side of the microelectronic element and electrically connected to the microelectronic element; a substrate electrode arranged on a side of the bonding substrate and electrically connected to the bonding substrate. The chip electrode and the substrate electrode can be embedded with each other so that the microelectronic element can be bonded to the bonding substrate. At least one of the chip electrode and the substrate electrode is a receiving structure, and the other is an insertion structure. The receiving structure includes a conductive substrate and an accommodation fixing structure arranged on the conductive substrate, and the accommodation fixing structure can be inserted by the insertion structure and fixed the insertion structure. The provided bonding assembly, microelectronic component and bonding backplane have the characteristics of simple repair process and low repair cost.