Micro-LED Fabrication With Bottom Emission and Color Conversion

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Solution Overview

Problem

Current micro-LED technologies face challenges in improving light extraction efficiency, modifying light color, and controlling angular output, which limits their practical application in commercial displays.

Innovation Solution

A method involving the fabrication of micro-light emitting diodes (micro-LEDs) by patterning an epitaxial semiconductor layer, bonding it to a carrier substrate, and electrically coupling drive circuitry for individual addressability, while incorporating optical features and color conversion layers to enhance light management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional LED packaging techniques are used for micro-LEDs, then manufacturing simplicity is maintained, but light extraction efficiency deteriorates and source position is scrambled

Engineering Contradiction:
Improvepackaging simplicityVSAvoidlight extraction efficiency
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent inverts the conventional LED packaging approach by extracting light from the semiconductor side rather than through the sapphire substrate. This inversion allows the micro-LED structure to maintain manufacturing simplicity while dramatically improving light extraction efficiency and preserving source position information, as the light exits directly from the active region without traversing the substrate.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent introduces a vertical dimension to light extraction by creating a reflective structure at the bottom of the semiconductor layer. This allows light to be extracted upward through the semiconductor side, adding a new extraction pathway that complements traditional side-emission approaches and improves overall extraction efficiency without complicating the packaging process.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If light is extracted through the sapphire layer, then manufacturing process is simplified, but source position information is lost due to waveguiding

Engineering Contradiction:
Improveextraction process simplicityVSAvoidsource position information
Core Design Contradiction:
Ease of manufactureVSLoss of information

Solution Approach 1:

Instead of extracting light through the sapphire substrate as in conventional designs, the patent inverts the extraction direction to pull light out from the semiconductor side. This preserves the spatial mapping of light sources to pixel positions while maintaining a relatively simple manufacturing process, as it leverages the existing micro-LED array structure without requiring complex substrate removal or reconfiguration.

Inventive Principle:
Principle #13The other way round (Inversion)

3Ease of operation

If both n- and p- sides are contacted from the top side, then connection simplicity is achieved, but fill factor deteriorates due to interconnect area sharing

Engineering Contradiction:
Improveconnection simplicityVSAvoidfill factor
Core Design Contradiction:
Ease of operationVSArea of stationary object

Solution Approach 1:

The patent moves the contact points to the bottom side of the micro-LED structure, utilizing the vertical dimension to separate interconnect locations from the light-emitting area. This allows the top surface to be fully dedicated to light emission, maximizing fill factor, while the bottom contacts provide simple electrical access without interfering with the optical active area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Illumination intensity

If micro-LED structures are used, then high luminance pixelated structures are achieved, but light extraction efficiency and color control deteriorate

Engineering Contradiction:
ImproveluminanceVSAvoidlight extraction efficiency
Core Design Contradiction:
Illumination intensityVSLoss of energy

Solution Approach 1:

The patent inverts the light extraction direction to pull light out from the semiconductor side rather than through the substrate. This inversion significantly improves light extraction efficiency by eliminating waveguiding losses in the substrate, while preserving the high luminance characteristics of micro-LEDs. The approach maintains the compact pixelated structure needed for displays while extracting more light from each micro-LED element.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent modifies the optical parameters of the micro-LED structure by introducing a reflective layer at the bottom of the semiconductor and adjusting the refractive index profile. These parameter changes enhance light extraction efficiency and enable better color control by managing the optical modes within the micro-LED cavity, while maintaining the high luminance output required for display applications.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables improved light extraction efficiency, color modification, and angular control, leading to higher performance and cost-effectiveness in micro-LED displays with increased active area utilization and flexibility in light extraction.

Implementation Method 1

an epitaxial semiconductor layer grown on a first face of the growth substrate

Methodology Applied
Scientific EffectEpitaxial growth: Epitaxy

Implementation Method 2

bonding the common contact to a carrier substrate

Methodology Applied
Scientific EffectBonding: Welding

Data Source

PatentEP3906581B1Method of fabricating display structures
Publication Date: 2024.09.11 LUMIODE INC
  • EP3906581B1 patent drawingFigure 1
  • EP3906581B1 patent drawingFigure 2
  • EP3906581B1 patent drawingFigure 3A~3B

AI summary

A system and method of are described related to structures that enable or facilitate improvement of micro-LED elements including contact, attachment, and integration of optical components. Implementations may benefit color conversion and optimization, light extraction angle, extraction efficiency, and contact reliability.