Micro-LED Panel Placement Using Inclined Bump-Dent Alignment
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Solution Overview
Problem
Micro-LED panels face issues with micro-LED chip misalignment during production, leading to insufficient connections with switching elements and luminance unevenness, which decreases display quality and increases production costs.
Innovation Solution
A method involving the production of micro-LED chips with a light blocking component having an inclined surface and an array substrate with an insulating film featuring a corresponding dent, allowing precise alignment and connection of micro-LED chips, eliminating the need for additional components to prevent misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro-LED chips are placed on an array substrate using conventional methods, then the production process is simple, but misalignment occurs between micro-LED chips and switching elements leading to insufficient connections and luminance unevenness
Solution Approach 1:
The light blocking component is designed with an asymmetric structure featuring a protruding portion with an inclined surface that fits into a corresponding recess in the insulating film. This asymmetric geometry provides mechanical guidance and constraint during the placement process, enabling precise alignment of micro-LED chips with switching elements without requiring complex external alignment mechanisms.
Solution Approach 2:
The light blocking component is pre-formed with an inclined surface protrusion that serves as an alignment feature before the micro-LED chip placement process. This preliminary structural preparation ensures that when the chip is placed, the inclined surfaces automatically guide the chip into the correct position, preventing misalignment and ensuring proper connection with switching elements.
2Manufacturing precision
If additional components are added to prevent misalignment, then alignment precision improves, but device complexity and production cost increase
Solution Approach 1:
The alignment function is merged into the light blocking component itself by incorporating the inclined surface protrusion structure. This eliminates the need for separate alignment components or features, as the light blocking component simultaneously performs its primary function of blocking light and provides the alignment guidance through its integrated inclined surface geometry that fits with the insulating film recess.
Solution Approach 2:
The light blocking component is designed to serve multiple functions: it blocks light from reaching underlying structures, provides mechanical alignment guidance through its inclined surface protrusion, and ensures proper positioning of micro-LED chips. This multi-functionality eliminates the need for additional dedicated alignment components, reducing overall device complexity while maintaining high alignment precision.
3Reliability
If micro-LED chips are placed without alignment features, then production process is simple, but connection reliability between micro-LED chips and switching elements decreases
Solution Approach 1:
The inclined surface protrusion of the light blocking component creates an asymmetric mechanical interface with the recess in the insulating film. This asymmetric geometry provides passive mechanical constraint that guides the micro-LED chip into the correct position during placement, ensuring reliable connection with switching elements without requiring complex active alignment systems or additional manufacturing steps.
Data Source
AI summary
Provided is a method of producing a micro-LED panel that can produce a micro-LED panel with excellent display quality by reducing misalignment of micro-LED chips and can achieve an increased yield. The method of producing a micro-LED panel includes: producing a micro-LED chip including a micro-LED, a first contact electrode, and a light blocking component; producing an array substrate including a switching element, a second contact electrode, and an insulating film; and placing the micro-LED chip on the array substrate. The light blocking component includes a bump with an inclined surface. The insulating film includes a dent with an inclined surface. The placing of the micro-LED chip includes electrically connecting the first contact electrode to the second contact electrode by making the bump of the light blocking component opposite to the dent of the insulating film.