Micro-LED Color Converter Transfer Using Laser Release Layers
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Solution Overview
Problem
Current micro-LED display manufacturing methods are inefficient due to high material waste and costly deposition processes for color conversion devices, which also lead to reliability issues with direct contact between color conversion materials and transparent conductors.
Innovation Solution
The method involves forming color conversion devices on a carrier substrate using a release layer that is selectively removed with a pulsed laser, allowing precise transfer to a display backplane, reducing material waste and avoiding direct contact with the transparent conductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If color conversion devices are directly deposited on transparent conductors, then the manufacturing process is simplified, but material waste increases and reliability deteriorates due to direct contact issues
Solution Approach 1:
A release layer is introduced as an intermediary between the color conversion device and the transparent conductor. This release layer enables the color conversion device to be formed on a carrier substrate, transferred to the display backplane, and then removed, preventing direct contact between the color conversion device and transparent conductor while eliminating material waste associated with direct deposition methods
2Ease of manufacture
If color conversion devices are directly deposited on transparent conductors, then the manufacturing process is simplified, but reliability deteriorates due to direct contact between color conversion materials and transparent conductors
Solution Approach 1:
The release layer serves as a temporary intermediary that facilitates the transfer process while preventing harmful direct contact between the color conversion device and transparent conductor. After transfer, the release layer is removed by laser irradiation, leaving the color conversion device positioned correctly without direct contact issues
Solution Approach 2:
The color conversion device is formed on the carrier substrate before transfer to the display backplane. This preliminary formation allows for controlled fabrication and quality assurance before final positioning, improving reliability while maintaining manufacturing efficiency
3Manufacturing precision
If conventional deposition processes are used for color conversion devices, then production costs increase, but manufacturing precision is maintained
Solution Approach 1:
The color conversion device is formed as a copy on the carrier substrate using cost-effective deposition processes, then transferred to the final position. This approach allows for precise fabrication at lower cost compared to direct deposition on the expensive display backplane
4Manufacturing precision
If material is deposited in excess to ensure complete coverage, then manufacturing precision is compromised, but material waste increases
Solution Approach 1:
The color conversion device fabrication is segmented into formation on carrier substrate followed by transfer to display backplane. This segmentation allows for precise patterning during formation without excessive material deposition, as the transfer process ensures accurate placement without requiring over-deposition for coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces material waste, lowers production costs, and enhances the reliability of micro-LED displays by minimizing interactions between color conversion devices and transparent conductors, while enabling efficient power consumption and improved manufacturing throughput.
Implementation Method 1
A pulsed laser is used to remove the release layer
Data Source
AI summary
Embodiments disclosed herein include micro light emitting device (LED) display panels and methods of forming such devices. In an embodiment, a display panel includes a display backplane substrate, a light emitting element on the display backplane, a transparent conductor over the light emitting element, a dielectric layer over the transparent conductor, and a color conversion device over the light emitting element. In an embodiment, the dielectric layer separates the transparent conductor from the color conversion device.


