Micro-LED Color Adjustment Patterning for Precise Display Transfer
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Solution Overview
Problem
The manufacturing of high-resolution display devices using micro-LEDs requires highly efficient and small LED chips, along with advanced techniques for precise placement, which existing technologies have not adequately addressed, leading to challenges in yield and durability.
Innovation Solution
A method of manufacturing display devices involves forming light-emitting areas with semiconductor layers, active layers, and common electrodes on a support substrate, followed by the creation of color adjustment patterns through light emission and curing processes, with specific voltage applications and reflective films to enhance light extraction and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If small LED chips are used to manufacture high-resolution display devices, then the resolution is improved, but the placement precision and transfer technique requirements increase
Solution Approach 1:
The patent applies preliminary action by forming color adjustment patterns on the LED chips before transfer to the substrate. The color adjustment layers are deposited and patterned on the LED chips while they are still on the temporary substrate, ensuring proper color characteristics are established before the complex transfer process. This preliminary color adjustment simplifies the subsequent transfer operation and ensures high placement precision for small LED chips.
2Manufacturing precision
If advanced transfer techniques are used to arrange small LED chips, then the placement precision is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent merges multiple operations into a unified process flow. The LED chips with color adjustment patterns are transferred as complete units to the substrate, combining the chip transfer and color pattern transfer into a single operation. This merging approach maintains high placement precision while reducing the number of separate manufacturing steps, thereby improving ease of manufacture.
Solution Approach 2:
The patent uses a temporary substrate as an intermediary carrier for the LED chips during the color adjustment process. This intermediary allows the color patterns to be formed on the chips in a controlled environment before final transfer to the display substrate, simplifying the overall manufacturing process while maintaining precision.
3Stability of the object's composition
If color adjustment patterns are formed by light emission and curing, then the color uniformity is improved, but the manufacturing time increases
Solution Approach 1:
The patent employs periodic action in the curing process by using sequential light emission from different sub-pixel regions. The blue, green, and red sub-pixels are activated in sequence to cure the color adjustment patterns, ensuring uniform curing across all regions while maintaining a controlled manufacturing cycle. This periodic activation prevents overheating and ensures even color distribution.
4Reliability
If multiple semiconductor layers and contacts are formed, then the device reliability is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the LED structure into distinct functional layers: first and second semiconductor layers with different conductive types, an active layer in between, and separate contact structures. This segmentation allows each layer to be optimized for its specific function while maintaining overall reliability. The multi-layer structure enables better control of electrical properties and improves device performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the yield and durability of display devices by stabilizing color adjustment patterns and enhancing light extraction, reducing defects and increasing the efficiency of the manufacturing process.
Implementation Method 1
forming a first color adjustment pattern on the first light-emitting area by emitting first light from the first light-emitting area
Implementation Method 2
curing a portion of the first color adjustment material layer by emitting the first light to the first color adjustment material layer
Implementation Method 3
forming a bonding layer between the support substrate and the first contact, wherein the support substrate and the first contact are bonded to each other by the bonding layer
Data Source
AI summary
A method of manufacturing a display device includes forming a first light-emitting area on a substrate, and forming a first color adjustment pattern on the first light-emitting area by emitting first light from the first light-emitting area, wherein the first light-emitting area includes a first semiconductor layer, a second semiconductor layer provided on the first semiconductor layer, a first active layer arranged between the first semiconductor layer and the second semiconductor layer, a first contact electrically connecting the substrate and the first semiconductor layer, and a first preliminary common electrode electrically connected to the second semiconductor layer.