Micro-LED Driving Substrate Bending Area Design
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Solution Overview
Problem
Micro-LED driving substrates face challenges in bending reliability due to high film layer thickness and strain in the bending area, leading to fractures or cracks when bent, which affects the quality and reliability of the driving substrate.
Innovation Solution
The driving substrate design includes a reduced number of film layers in the bending area by using a first buffer layer, an overlapping electrode layer, and an organic material layer, reducing the thickness and maximum bending strain, thereby preventing fractures and ensuring improved quality and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the driving substrate includes multiple film layers (rigid substrate, debonding layer, buffer layers, organic material layer, wiring layer) in the bending area, then the structural integrity and electrical connectivity are maintained, but the film layer thickness increases causing high bending strain that leads to fractures or cracks
Solution Approach 1:
The patent removes the rigid substrate from the bending area while maintaining it in the component disposing area and circuit board binding area. This extraction of the rigid substrate from the bending region eliminates the primary source of bending strain, allowing the bending area to flex without causing fractures in thick film layers.
Solution Approach 2:
The patent applies different structural configurations to different areas of the driving substrate. The component disposing area and circuit board binding area maintain the full multi-layer structure with rigid substrate for structural integrity, while the bending area uses a simplified structure without the rigid substrate to enable flexibility and reduce bending strain.
2Strength
If the rigid substrate is present in the bending area, then the structural support is provided, but the bending strain increases causing fractures or cracks in the film layers
Solution Approach 1:
The patent divides the driving substrate into distinct functional areas: component disposing area, circuit board binding area, and bending area. Each area has a customized structure optimized for its function. The bending area is segmented from the rigid substrate to allow independent flexing without compromising the structural support in other areas.
3Reliability
If the film layer thickness is reduced in the bending area, then the bending strain is reduced preventing fractures, but the structural integrity and electrical connectivity may be compromised
Solution Approach 1:
The patent maintains the full multi-layer structure with rigid substrate in the component disposing area and circuit board binding area where structural integrity is critical, while using a simplified structure without rigid substrate in the bending area where flexibility is prioritized. This local differentiation resolves the contradiction by optimizing each area for its primary function.
Data Source
AI summary
Provided are a driving substrate, a light emitting apparatus and a manufacturing method therefor, which relate to the technical field of display. According to the present disclosure, a rigid substrate, a debonding layer, a first buffer layer, an organic material layer, a second buffer layer and a wiring layer are sequentially arranged in layer configuration in a component disposing area and a circuit board binding area, and the first buffer layer, an overlapping electrode layer, the organic material layer and the second buffer layer are sequentially arranged in layer configuration in a bending area. Two ends of the overlapping electrode layer respectively extend to the component disposing area and the circuit board binding area, and the wiring layer of the component disposing area and the wiring layer of the circuit board binding area are respectively connected to the overlapping electrode layer through via holes.