Micro-LED Mass Transfer via Dual-Polarity Substrate Segmentation
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Solution Overview
Problem
Current mass transfer processes for micro-LEDs are complex and costly, whether through direct or indirect transfer methods, requiring multiple steps and high operational costs.
Innovation Solution
A method that divides micro-LED devices into two groups, bonding each group with separate transfer substrates and then separating them once, simplifying the process and reducing costs by eliminating the need for complex separation and additional steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If direct transfer or indirect transfer methods are used for mass transfer of micro-LEDs, then the transfer can be completed, but the process becomes complicated and costs increase
Solution Approach 1:
The invention divides the micro-LED array into two groups (first plurality and second plurality) and bonds each group to separate transfer substrates (first and second transfer substrates) with opposite polarities. This segmentation allows independent handling and transfer of each group, simplifying the overall mass transfer process by eliminating the need for complex sequential operations required in traditional direct or indirect transfer methods.
Solution Approach 2:
The invention uses transfer substrates with opposite polarities (first transfer substrate with positive polarity, second transfer substrate with negative polarity) to bond to opposite surfaces of the micro-LED array. This inverted approach of using dual-polarity substrates simultaneously enables both groups to be transferred in one operation, reversing the traditional sequential transfer process and significantly reducing process complexity.
2Productivity
If traditional direct or indirect transfer methods are used, then micro-LEDs can be transferred, but additional separation processes and post-transfer steps are required
Solution Approach 1:
The invention performs preliminary bonding of both the first and second transfer substrates to the micro-LED array simultaneously before any separation occurs. By pre-establishing both bonds in advance, the system enables direct transfer to final substrates without requiring intermediate separation steps, thus eliminating time loss associated with sequential operations and improving overall productivity.
Solution Approach 2:
The invention merges the transfer operations for both groups of micro-LEDs into a single simultaneous process. By bonding first and second transfer substrates to opposite surfaces at the same time and transferring both groups together in one operation, the method combines multiple sequential steps into a single integrated process, eliminating additional separation and post-transfer steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the mass transfer process and reduces costs by eliminating the need for complex separation and additional steps, making the process more efficient and cost-effective.
Implementation Method 1
With the development of technology, the development of massive transfer process has produced many technical branches, such as electrostatic adsorption, laser burning, and so on.
Data Source
AI summary
A micro-LED macro transfer method, a micro-LED display device, and a method for fabricating the same are provided. In the micro-LED macro transfer method, the LED chips on an array are divided into a first plurality of LED chips and a second plurality of LED chips. An LED chip includes a first surface and a second surface. The first plurality of LED chips are configured so that their first surfaces are coupled to the first transfer substrate. The second plurality of LED chips are configured so that their second surfaces are coupled to the second transfer substrate. Accordingly, the first transfer substrate transfers the first plurality of LED chips to the first transfer substrate while the second transfer substrate transfers the second plurality of LED chips to the second transfer substrate.