Micro-LED Display Panel Transfer Using Glue Residue Alignment
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Solution Overview
Problem
The precision and accuracy of micro-LED transfer in micro-LED display production are compromised by mechanical operation errors and misalignment, leading to inefficiencies in the transfer process and reduced yield.
Innovation Solution
A fabrication method involving the formation of supporting structures and a glue layer on a circuit substrate, allowing for precise placement and transfer of micro-LEDs using a transfer device, with the glue layer residue aiding in the retention and alignment of LEDs, followed by cutting and grinding to finalize the panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If mechanical transfer operations are used to transfer micro-LEDs, then the transfer process can be automated, but machine operation errors and misalignment reduce placement precision and yield
Solution Approach 1:
A transfer substrate is introduced as an intermediary carrier to hold multiple micro-LEDs in an array configuration. This mediator enables simultaneous transfer of multiple LEDs to the circuit substrate, reducing the number of mechanical operations required and thereby minimizing cumulative positioning errors while maintaining automation.
Solution Approach 2:
Multiple micro-LEDs are pre-positioned on the transfer substrate in the correct array configuration before the transfer process begins. This preliminary arrangement ensures that when the transfer occurs, the LEDs are already in their final positions, eliminating the need for individual positioning operations and improving both precision and efficiency.
2Manufacturing precision
If individual micro-LEDs are transferred one by one, then placement accuracy can be maintained, but production cycle time increases
Solution Approach 1:
The transfer process is segmented into two distinct stages: first, multiple micro-LEDs are mounted on the transfer substrate in parallel; second, the entire array is transferred to the circuit substrate in a single operation. This segmentation allows high-volume parallel preparation without sacrificing final placement accuracy, thereby reducing overall production cycle time.
Solution Approach 2:
Multiple individual transfer operations are merged into a single collective transfer operation. By combining multiple micro-LEDs onto one transfer substrate and transferring them simultaneously to the circuit substrate, the method achieves both high productivity through parallel processing and high precision through the unified transfer action.
3Manufacturing precision
If supporting structures are added to improve alignment, then placement accuracy improves, but device complexity and fabrication steps increase
Solution Approach 1:
The transfer substrate itself provides the alignment function through its pre-configured array structure and mechanical features. The supporting structures are integrated into the transfer substrate design, allowing it to self-align with the circuit substrate through simple mechanical engagement. This self-aligning mechanism improves placement accuracy without requiring complex external alignment systems or additional fabrication steps.
Data Source
AI summary
A display panel includes a circuit substrate, a first supporting structure, a glue layer residue and light-emitting diodes. The circuit substrate has electrodes. The first supporting structure is located outside the electrodes on the circuit substrate. The glue layer residue is located on the first supporting structure. The light-emitting diodes are electrically connected to the electrodes.