Micro-LED Pixel Interconnect Layout for Higher Display Density
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Solution Overview
Problem
Conventional micro-LED display panels face challenges in arranging more micro-LEDs due to the significant space required for electrical connections between light emitting layers, which constrains the panel's density and efficiency.
Innovation Solution
The micro-LED display panel design incorporates a micro pixel array with at least two coaxial light emitting layers separated by a dielectric layer, featuring interconnected structures that electrically connect each light emitting layer to electrodes, reducing the number of bottom interconnected structures and allowing for more flexible wiring and increased density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If each light emitting layer is electrically connected to a respective electrode with separate interconnected structures, then each light emitting layer can be independently controlled, but the number of interconnected structures increases significantly, consuming substantial space within the micro-LED display panel
Solution Approach 1:
The patent merges the electrical connection function for multiple light emitting layers into a single shared interconnected structure. Instead of providing separate interconnected structures for each light emitting layer, the invention designs one interconnected structure that can electrically connect multiple light emitting layers to their respective electrodes, thereby reducing the total number of interconnected structures and the space they occupy while maintaining independent control capability
Solution Approach 2:
The interconnected structure is designed to perform multiple functions simultaneously - it serves as the electrical connection for multiple different light emitting layers (first, second, third light emitting layers) through a single unified structure, making it a multi-functional component that reduces overall device complexity and space requirements
2Reliability
If multiple separate interconnected structures are used for each light emitting layer, then reliable electrical connections are established, but the density of micro-LEDs that can be arranged on the panel is reduced
Solution Approach 1:
By combining the electrical connection function for multiple light emitting layers into a single interconnected structure, the patent reduces the total number of components that need to be arranged on the panel. This merging approach maintains reliable electrical connections for each light emitting layer while freeing up space to accommodate a higher quantity of micro-LEDs on the same panel area
3Ease of operation
If conventional electrical connection structures are used for multiple light emitting layers, then each layer can be controlled, but the wiring becomes complex and space-consuming
Solution Approach 1:
The patent merges multiple wiring paths into a single interconnected structure that handles electrical connections for multiple light emitting layers. This consolidation simplifies the wiring architecture by reducing the number of separate conductive paths needed, making the overall device less complex while preserving the ability to independently control each light emitting layer through the unified structure
Data Source
AI summary
A micro-LED display panel includes a micro pixel array area having a plurality of micro pixel areas, each micro pixel area including a micro-LED. The micro-LED includes at least two light emitting layers in a vertical direction and a dielectric layer formed between adjacent ones of the light emitting layers, an IC backplane formed at a back surface of the micro-LED and configured to control the light emitting layers, and a plurality of interconnected structures configured to electrically respectively connect each light emitting layer to electrodes. The interconnected structures include one or more top interconnected structures configured to electrically connect a top of each of the light emitting layers to a first electrode, and one or more bottom interconnected structures configured to electrically connect a bottom of each of the light emitting layers to the IC backplane to a second electrode. The interconnected structures are formed around each micro pixel area, one bottom interconnected structure corresponds to one micro-LED, and one top interconnected structure corresponds to adjacent micro-LEDs.