Micro-LED Panel Interconnect Layout Without Sloped Metal Lines
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Solution Overview
Problem
Micro-LED display panels face issues with metal lines breaking due to the need to climb a height differential of 30-50 microns, leading to electrical connectivity failures between the driving circuit and upper electrodes.
Innovation Solution
The implementation of conductive blocks and top wires on the substrate and insulating layer, respectively, allows for electrical connection between the driving circuit and upper electrodes without the need for metal lines to climb a slope, using a method that includes transferring micro-LEDs and conductive blocks onto a substrate, forming an insulating layer, and connecting top wires to upper electrodes and conductive blocks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal lines are used to connect driving circuit to upper electrodes, then electrical connection is achieved, but metal lines are prone to breaking due to height differential
Solution Approach 1:
The patent transitions from a planar metal line connection to a three-dimensional structure using conductive blocks that rise from the substrate to match the height of micro-LED upper electrodes. This dimensional change allows direct horizontal connection at the same elevation, eliminating the need for sloped metal lines and associated breaking risks.
Solution Approach 2:
Conductive blocks serve as intermediary structures between the substrate-level driving circuit and the elevated micro-LED upper electrodes. These blocks provide a physical and electrical bridge that eliminates the height differential problem, allowing standard planar metal line routing without slopes or breaks.
2Ease of operation
If metal lines climb a slope to overcome height differential, then connection between driving circuit and upper electrodes is established, but the metal line is prone to breaking
Solution Approach 1:
The conductive blocks elevate the connection point to the same potential level (height) as the micro-LED upper electrodes. This creates an equipotential connection surface where metal lines can run horizontally without slopes, eliminating stress concentrations that lead to breaking while maintaining ease of electrical connection establishment.
3Ease of manufacture
If conventional metal line routing is used, then manufacturing process is simple, but metal lines break at slope locations
Solution Approach 1:
The patent segments the electrical connection path into distinct functional elements: substrate-level driving circuit, vertical conductive block risers, and horizontal metal line connectors. This segmentation allows each component to be optimized independently - conductive blocks handle the height differential while metal lines maintain simple horizontal routing, preserving manufacturing simplicity while eliminating breakage.
Data Source
AI summary
A method for making a micro-LED display panel includes providing a substrate; transferring micro-LEDs on a surface of the substrate; transferring conductive blocks on the surface of the substrate having the micro-LEDs; forming an insulating layer to cover the micro-LEDs and the conductive blocks; forming upper electrodes, each of the upper electrodes covering a surface of one of the micro-LEDs away from the substrate; and forming top wires on a surface of the insulating layer away from the substrate.