Micro-LED Active-Matrix Layout Without Substrate Thinning
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Solution Overview
Problem
Existing μLED display technologies face challenges in producing LEDs with emission surfaces opposite their electrical contacts, requiring costly and fragile substrate thinning or transfer operations, which limit production yield and introduce mechanical weaknesses.
Innovation Solution
A μLED display design with a transparent support plate and conductive elements that allow electrical connections between μLEDs and an active matrix without the need for contacts on the emission face, using multiple power supply planes and conductive vias to distribute power efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If substrate thinning or removal is performed to allow light transmission and color conversion layer production, then light transmission is improved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent inverts the conventional arrangement by placing the emission surface on the same side as the electrical contacts. This is achieved through specific μLED structure design where the light-emitting layer is positioned to emit through the active matrix side, eliminating the need for substrate thinning or removal while maintaining light transmission capability
Solution Approach 2:
The patent extracts the requirement for substrate thinning or removal from the manufacturing process by redesigning the μLED structure. The emission surface is configured to face the active matrix directly, taking out the problematic substrate modification steps while preserving the essential light transmission function
2Illumination intensity
If substrate thinning or removal is performed, then light transmission is improved, but mechanical strength and reliability deteriorate
Solution Approach 1:
By inverting the emission orientation to face the active matrix side, the patent maintains the full substrate thickness, thereby preserving mechanical strength and reliability while achieving light transmission through proper μLED structural design and material selection
3Shape
If multiple substrate transfers are performed, then emission surface positioning is improved, but production yield and manufacturing efficiency worsen
Solution Approach 1:
The patent performs preliminary action by pre-configuring the μLED structure during fabrication with the emission surface oriented toward the active matrix side. This preliminary structural design eliminates the need for subsequent substrate transfer operations, improving production yield and manufacturing efficiency while achieving correct emission surface positioning
4Illumination intensity
If emission surface is positioned opposite electrical contacts, then light transmission is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies inversion by positioning the emission surface on the same side as the electrical contacts (active matrix side) rather than opposite them. This is achieved through specific μLED layer structure design where the light-emitting layer is configured to emit through the active matrix interface, simplifying device architecture while maintaining effective light transmission
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces production steps, minimizes contacts, and enhances mechanical robustness while ensuring uniform power distribution and heat dissipation, thereby improving production yield and reducing costs.
Implementation Method 1
a substrate (11) comprising, on a lower portion thereof, a conductive surface (12) acting as a common electrode and, on an upper portion thereof, a plurality of light-emitting diodes (13) and their electrical control contacts (14)
Implementation Method 2
each chip with μLEDs comprising a plurality of light-emitting diodes (13), the light-emitting diodes being arranged on the same side of the chip as their control contacts (14)
Data Source
AI summary
A display includes a plurality of electronic chips with μLEDs and an active matrix for controlling the chips, the active matrix being mounted on a transparent slide, each chip comprising a plurality of light-emitting diodes, each chip comprising a substrate comprising an electrode which is common to the μLEDs and, on the upper portion thereof, the μLEDs and their electrical control contacts. The display comprises: one or more power supply planes arranged on the upper face of a support plate; the plurality of electronic chips, first conductive elements providing the electrical connections between the common electrodes of each chip and the power supply planes; the transparent slide bearing the active matrix, second conductive elements providing the electrical connections between the electrical contacts of the electronic chips and the electrical contacts for controlling the active matrix.