Micro-LED Optics and Stepped Mesa Layout for Low Cross-Talk

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Solution Overview

Problem

Fibre-optic communication systems face challenges in achieving high-density μLED arrays due to optical interference and cross-talk, which limits the number of communication channels per unit area.

Innovation Solution

The fabrication method involves epitaxial growth of semiconductor layers, selective etching to form a stepped mesa without sidewall bumps, and the application of nano-imprinted optics to focus and collimate light emission, reducing optical interference and allowing closer spacing of μLEDs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If μLED density is increased to allow more communication channels per unit area, then channel capacity is improved, but optical interference and cross-talk increase

Engineering Contradiction:
Improvenumber of communication channels per unit areaVSAvoidoptical interference and cross-talk
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by creating asymmetric stepped mesa structures where different regions of the LED have different heights. This local structural variation directs light emission in specific directions, concentrating optical energy into targeted communication channels while minimizing spread to adjacent channels, thereby reducing cross-talk and optical interference even at high densities

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent transitions from a conventional planar LED structure to a three-dimensional stepped mesa structure. By introducing vertical dimensionality with multiple height levels, the device achieves directional light control without increasing lateral footprint, enabling higher channel density while maintaining optical isolation between channels through spatial separation in the vertical dimension

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If conventional LED fabrication processes are used, then manufacturing is simpler, but side-wall bumps form increasing device size and light emission from sides

Engineering Contradiction:
Improvefabrication process simplicityVSAvoidside-wall bumps increasing physical size and side emission
Core Design Contradiction:
Ease of manufactureVSShape

Solution Approach 1:

The patent segments the LED structure into multiple discrete height levels forming stepped mesas. This segmentation is achieved through selective etching processes that create distinct terraces at different elevations. The segmented structure eliminates continuous side-wall bumps by replacing them with discrete stepped surfaces, reducing unwanted lateral light emission while maintaining manufacturing feasibility through standard semiconductor processing techniques

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances μLED density and reduces cross-talk, enabling higher channel densities and efficient light extraction, facilitating scalable and efficient optical communication systems.

Implementation Method 1

The nano-imprinted optic may improve the efficiency with which light can be extracted from the light-emitting structure, by reducing losses caused by total internal reflection

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 2

the nano-imprinted optic may reduce optical interference between nearby LEDs by focussing and/or collimating the emitted light

Methodology Applied
Scientific EffectFocusing: Focusing

Implementation Method 3

the nano-imprinted optic may reduce optical interference between nearby LEDs by focussing and/or collimating the emitted light

Methodology Applied
Scientific EffectCollimation:

Implementation Method 4

a lens obtainable by thermal reflow lithography arranged over the light-emitting structure. Thermal reflow lithography may allow a lens to be fabricated from materials with high refractive indices. This may reduce losses due to internal reflection

Methodology Applied
Scientific EffectThermal reflow lithography:

Implementation Method 5

Thermal reflow lithography may allow a lens to be fabricated from materials with high refractive indices

Methodology Applied
Scientific EffectRefraction: Refraction

Data Source

PatentUS20250351629A1Micro-LEDs for optical communication systems
Publication Date: 2025.11.13 MICROSOFT TECHNOLOGY LICENSING LLC
  • US20250351629A1 patent drawing
  • US20250351629A1 patent drawing
  • US20250351629A1 patent drawing

AI summary

A method of manufacturing a light-emitting diode device comprises fabricating a light-emitting diode structure comprising an inorganic semiconductor; and fabricating an optic over the light-emitting diode structure using nano-imprint lithography. The method may further comprise, before fabricating the optic, forming a first lens on the light-emitting diode structure by thermal reflow lithography. The optic and first lens may improve the efficiency of the light-emitting diode device by reducing losses due to total internal reflection. Also provided are light emitting diode devices obtainable by the method.