Micro-LED Display Panel Layout Without Adhesive Chip Bonding
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Solution Overview
Problem
Existing micro-LED display panels face issues of poor stability and low yield due to low bonding strength between LED chips and the driving base substrate, primarily caused by anisotropic conductive adhesive or metal binding processes.
Innovation Solution
A display panel architecture where the thin film transistor array layer is formed on the side of the micro-light emitting device layer facing away from the light output side, eliminating the need for anisotropic conductive adhesive or metal binding processes, and incorporating a stretchable board made of polydimethylsiloxane (PDMS) for enhanced stability and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If anisotropic conductive adhesive binding process or metal binding process is used to transfer LED chips to the driving base substrate, then the LED chips can be transferred to the substrate, but the bonding strength between the LED chip and the driving base substrate is low, resulting in poor stability and low yield
Solution Approach 1:
The patent removes the separate binding layer (anisotropic conductive adhesive or metal binding process) from the structure. Instead of using a distinct adhesive layer to bond LED chips to the driving base substrate, the LED chips are directly formed on the substrate through a unified thin film structure, eliminating the interface that caused weak bonding
Solution Approach 2:
The patent merges the LED chip structure and the driving base substrate into a single integrated thin film structure. The LED chips, driving circuits, and substrate are formed together in one continuous thin film layer, creating strong intrinsic bonding without requiring separate adhesive layers
2Ease of manufacture
If anisotropic conductive adhesive binding process or metal binding process is used to transfer LED chips to the driving base substrate, then the LED chips can be transferred to the substrate, but the process is relatively more difficult
Solution Approach 1:
The patent segments the manufacturing process into two main stages: first forming the complete LED chip structure with driving circuits on a thin film substrate, then transferring the entire integrated structure as a unit. This segmentation allows each stage to be optimized independently and simplifies the overall process compared to sequential chip mounting
Solution Approach 2:
The patent performs preliminary formation of the complete LED chip structure, driving circuits, and interconnections on the thin film substrate before the final transfer step. All critical structures are pre-formed in their final positions, eliminating the need for complex post-transfer alignment and bonding operations
Data Source
AI summary
A display panel and a method for fabricating the same are disclosed. The display panel includes a base substrate, a micro-light emitting device layer and a thin film transistor array layer. The micro-light emitting device layer is disposed on one side of the base substrate, a light output side faces to the base substrate, and the thin film transistor array layer is formed on the side of the micro-light emitting device layer facing away from the light output side. LED chips do not need to be bound and connected to the thin film transistor array layer through a conductive adhesive bonding process or a metal bonding process during mass transfer, so that the stability and yield are improved.