Micro-LED Pixel Connection Structure for Uniform Luminance
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Solution Overview
Problem
Conventional display devices face challenges in aligning ultra-small light emitting diodes due to electrical shorts and non-uniform dielectrophoretic forces, leading to lighting defects, luminance deviations, and increased manufacturing costs as pixel sizes decrease.
Innovation Solution
A display device with a substrate, barrier rib, and semiconductor light emitting device, where a conductive liquid photosensitive material forms a first connection part on the barrier rib, ensuring maximum luminance and uniformity by maximizing contact area with the light emitting device, regardless of wiring layer configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If assembling wirings are disposed in different layers to prevent electrical shorts, then electrical short is avoided, but the dielectrophoretic force becomes non-uniform causing light emitting device misalignment
Solution Approach 1:
The patent transitions from a two-dimensional planar wiring arrangement to a three-dimensional stacked wiring configuration. By disposing first and second assembling wirings in different layers (different heights), the patent prevents electrical shorts while maintaining uniform dielectrophoretic force through vertical stacking rather than horizontal separation. This dimensional change resolves the contradiction by allowing wiring separation in the vertical dimension while keeping horizontal spacing adequate for force uniformity.
Solution Approach 2:
The patent segments the assembling wiring structure into multiple independent layers, with each layer containing assembling wirings that are electrically isolated from other layers. This segmentation allows the system to prevent electrical shorts between wirings while maintaining uniform dielectrophoretic force within each layer, as each layer can be independently optimized for force uniformity.
2Manufacturing precision
If pixel size is reduced to achieve high resolution, then more pixels can be displayed, but the gap between assembling wirings narrows causing electrical shorts
Solution Approach 1:
The patent resolves the electrical short problem in high-resolution displays by moving wiring separation from the horizontal plane to the vertical dimension. By stacking assembling wirings in different layers at different heights, the patent maintains adequate horizontal spacing for force uniformity while achieving vertical separation for short prevention, enabling high pixel density without electrical shorts.
Solution Approach 2:
The patent applies preliminary insulation treatment by disposing insulating films between stacked assembling wirings before the self-assembly process. This preliminary action of insulating the wirings allows them to be placed in close vertical proximity without risk of electrical shorts, enabling high-resolution pixel arrangements while maintaining wiring reliability.
3Ease of operation
If light emitting device is moved near pixel using magnetic body, then alignment is facilitated, but the device may not be properly aligned due to its light weight
Solution Approach 1:
The patent creates a uniform dielectrophoretic force field between the stacked assembling wirings, forming an equipotential region that evenly acts on the light emitting device. This uniform force field ensures that lightweight devices are properly positioned and held in place during self-assembly, preventing misalignment that occurs with non-uniform forces from conventional single-layer wiring.
4Ease of manufacture
If conventional assembling wirings are used in the same layer, then manufacturing is simpler, but electrical shorts occur due to narrow gaps
Solution Approach 1:
The patent transitions from single-layer planar wiring to multi-layer stacked wiring configuration. By disposing assembling wirings in different vertical layers with insulating films between them, the patent eliminates electrical shorts while maintaining manufacturing simplicity through standardized layering processes that can be integrated into existing fabrication workflows.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures consistent luminance across pixels, minimizes lighting defects, and reduces manufacturing costs by maintaining high luminance and image quality even with varying wiring layer configurations.
Implementation Method 1
a first connection part disposed in the assembly hole and on the barrier rib and electrically connected to a side surface of the semiconductor light emitting device
Implementation Method 2
the self-assembly method that transfers light emitting devices onto a substrate using a magnetic body (or magnet) has recently been in the spotlight
Implementation Method 3
A light emitting device is fixed to each pixel by a dielectrophoretic force formed by a voltage applied to a pair of assembling wiring
Data Source
AI summary
The display device can include a substrate, a barrier rib having an assembly hole on the substrate, a semiconductor light emitting device in the assembly hole, and a first connection part disposed in the assembly hole and on the barrier rib and electrically connected to a side surface of the semiconductor light emitting device. In the embodiment, maximum luminance can always be obtained regardless of whether the assembling wirings disposed on the substrate are disposed on the same layer or different layers, and each pixel has constant luminance, thereby improving image quality due to luminance uniformity.