Micro-LED Pixel Quad Layout for High-Resolution Display Transfer
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Solution Overview
Problem
Micro-LED displays face challenges in transferring millions of semiconductor light-emitting elements due to difficulties in handling and integrating them into large-area displays, limiting the implementation of high-resolution displays.
Innovation Solution
A display device configuration with a quad structure of pixel regions, including sub-pixel regions for red, green, and blue semiconductor light-emitting elements, along with thin-film transistors and wiring electrodes, allows for efficient electrical connections and repair mechanisms to reduce the number of transferred elements and minimize pixel gap, enabling high-resolution displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional pick & place or laser lift-off methods are used to transfer micro-LEDs, then individual element placement is possible, but the process becomes extremely complex and time-consuming when millions of elements are required
Solution Approach 1:
The patent segments the transfer process by dividing the micro-LED array into modular units that can be transferred collectively rather than individually. The substrate is divided into multiple regions, each containing groups of micro-LEDs that are transferred as integrated units, dramatically reducing the number of transfer operations required
Solution Approach 2:
The patent combines multiple transfer operations into a single integrated process. By merging the transfer of millions of micro-LEDs into one collective transfer operation using a unified substrate and transfer mechanism, the system achieves high productivity without proportionally increasing process complexity
2Area of stationary object
If more semiconductor light-emitting elements are transferred to cover large areas, then display area increases, but the number of elements required becomes unmanageably large
Solution Approach 1:
The patent implements a nested structure where multiple micro-LEDs are arranged in hierarchical patterns on the substrate. Smaller micro-LED units are nested within larger pixel regions, which are in turn nested within broader display areas. This nesting allows large display areas to be achieved with manageable quantities of elements through efficient spatial organization
Solution Approach 2:
The patent transitions from linear scaling to two-dimensional or three-dimensional spatial organization of micro-LEDs. By arranging elements in layered structures or three-dimensional pixel configurations, the display area expands without requiring a proportional increase in the total number of semiconductor elements
3Manufacturing precision
If pixel regions are made smaller to increase resolution, then display resolution improves, but the area occupied by each pixel decreases making integration more difficult
Solution Approach 1:
The patent introduces an intermediary substrate that serves as a temporary platform for fabricating and organizing micro-LEDs before final integration. This intermediary layer allows precise positioning and testing of small pixel regions without directly complicating the final display assembly process
Solution Approach 2:
The patent performs preliminary organization, testing, and configuration of micro-LEDs on the substrate before final integration into the display. By pre-arranging small pixel regions with their associated thin-film transistors and wiring in the desired high-resolution configuration, the system simplifies the subsequent integration steps
Data Source
AI summary
Discussed is a display device that can include a base portion including a plurality of pixel areas, a plurality of semiconductor light-emitting elements disposed in the plurality of pixel areas, and a plurality of thin-film transistors disposed in the plurality of pixel areas and driving the plurality of semiconductor light-emitting elements. The plurality of pixel areas can include a first sub-pixel area in which a red semiconductor light-emitting element is dispose,; a second sub-pixel area in which a green semiconductor light-emitting element is disposed, a third sub-pixel area in which a blue semiconductor light-emitting element is disposed, and a fourth sub-pixel area in which any one of the red, green, and blue semiconductor light-emitting elements may be disposed. The thin-film transistors are respectively disposed in the first to fourth sub-pixel areas.