Mirror-Symmetric Micro-LED Projector Layout for Easier Wiring

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Solution Overview

Problem

Existing display technologies face challenges in efficiently integrating micro-LEDs for high-resolution, high-brightness displays, particularly in augmented and mixed reality systems, due to issues with wiring and alignment of LED dies and backplane connections.

Innovation Solution

The use of symmetrically arranged and rotated LED dies and backplane connections in left and right projectors, along with specific pad arrangements, to facilitate efficient electrical connections and alignment in display packages.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If micro-LEDs are used for high-resolution displays, then display resolution and brightness are improved, but wiring and alignment complexity increases

Engineering Contradiction:
Improvedisplay resolutionVSAvoidwiring and alignment complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent applies asymmetry by implementing different symmetric patterns for left and right display packages. The left display package has LED dies arranged with a first symmetric pattern, while the right display package has LED dies arranged with a second symmetric pattern that is different from the first. This asymmetric design between left and right packages simplifies the overall wiring and alignment complexity while maintaining high display resolution and brightness performance.

Inventive Principle:
Principle #4Asymmetry

2Illumination intensity

If multiple LED dies are integrated in display packages, then display brightness and resolution are improved, but manufacturing complexity increases

Engineering Contradiction:
Improvedisplay brightnessVSAvoidmanufacturing complexity
Core Design Contradiction:
Illumination intensityVSEase of manufacture

Solution Approach 1:

The patent reduces manufacturing complexity by implementing asymmetric symmetric patterns. The left display package uses a first symmetric pattern for arranging multiple LED dies, while the right display package uses a second symmetric pattern. This approach maintains high display brightness through multiple LED dies while simplifying the manufacturing process compared to identical complex arrangements in both packages.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The patent segments the display system into separate left and right display packages, each with their own symmetric patterns of LED dies. This segmentation allows independent optimization and simplification of each package's manufacturing process while achieving the required high brightness through the combined effect of multiple LED dies in each segmented unit.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables improved wiring access and alignment, enhancing the performance and efficiency of micro-LED displays in augmented and mixed reality systems.

Implementation Method 1

Light emitting diodes (LEDs) convert electrical energy into optical energy

Methodology Applied
Scientific EffectLight emitting diode: Light Emitting Diode

Data Source

PatentUS12582002B2Left and right projectors for display device
Publication Date: 2026.03.17 META PLATFORMS TECHNOLOGIES LLC
  • US12582002B2 patent drawing
  • US12582002B2 patent drawing
  • US12582002B2 patent drawing

AI summary

Disclosed herein are display systems with multiple display packages. In some examples, a first display package includes a first LED die and a first backplane die. The first LED die includes a wire interface that is symmetric about a first plane. The first backplane die includes input/output (I/O) pads that are electrically connected to the wire interface and symmetric about a second plane, perpendicular to the first plane. A similarly configured second display package includes a second LED die with a wire interface identical in layout to that of the first LED die, and a second backplane die with I/O pads identical in layout to that of the first backplane die. The second LED die can be positioned with respect to the second backplane die as a mirror reflection across the second plane of the position of the first LED die with respect to the first backplane die.