MicroLED Package Structure With Reflective Cavity Walls
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Solution Overview
Problem
Current microLED technologies face challenges in miniaturization, as packaged LED components are typically in the millimeter range, limiting scalability and application in miniaturized devices such as indicator lights, where smaller, individual microLED components are needed.
Innovation Solution
The development of an optoelectronic semiconductor component with a reduced component size, featuring a carrier with contact structures and a package with a reflective wall that is integrally bonded, allowing for the creation of microLED components with dimensions in the micrometer range, enabling scalable applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional packaged LED components are used, then mechanical stability and electrical connectivity are maintained, but component size remains in the millimeter range, limiting miniaturization
Solution Approach 1:
The patent segments the packaging structure into a carrier substrate and a separate package structure that is form-fittingly connected to it. This segmentation allows the component size to be reduced to micrometer range while maintaining the functional integrity of each segment, resolving the contradiction between miniaturization and reliability
Solution Approach 2:
The optoelectronic semiconductor chip is nested within the package structure, which itself is connected to the carrier substrate. This nested arrangement enables compact integration of multiple functional elements in a hierarchical manner, achieving miniaturization while preserving mechanical stability and electrical connectivity through the structured nesting
2Length of moving object
If component size is reduced to micrometer range, then scalability for miniaturized applications is enabled, but manufacturing complexity increases
Solution Approach 1:
The patent merges the carrier substrate and package structure through form-fitting connection, creating an integrated assembly that simplifies the manufacturing process. This merging approach allows standard fabrication techniques to be applied to both components before final assembly, reducing overall manufacturing complexity despite the micrometer-scale dimensions
Solution Approach 2:
The carrier substrate serves multiple functions: it provides mechanical support, electrical connectivity through contact structures, and a mounting platform for the package. This multi-functionality reduces the number of separate components needed, thereby simplifying manufacturing processes while enabling micrometer-scale component size
3Length of moving object
If package wall thickness is reduced to single-digit or double-digit micrometer range, then component miniaturization is achieved, but structural strength decreases
Solution Approach 1:
The package structure employs composite material construction with reflective package walls that provide both mechanical strength and optical functionality. This composite approach allows the walls to be thin (single-digit or double-digit micrometers) while maintaining structural integrity through material composition rather than relying solely on wall thickness
4Productivity
If monolithic batch production is used, then manufacturing efficiency is high, but individual packaging and installation capability is lost
Solution Approach 1:
The patent segments the production approach by creating individually packageable microLED components that can be produced in batches on carrier substrates and then separated for individual installation. This segmentation enables both high manufacturing efficiency during batch production and individual packaging capability for scalable applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of microLED components with dimensions suitable for miniaturized applications, such as indicator lights, by ensuring efficient radiation emission and homogeneous color mixing through reflective packaging, while maintaining mechanical stability and electrical connectivity.
Implementation Method 1
a package (6), which is form-fittingly connected to the carrier (2) and has a cavity (7) which is laterally delimited by a reflective package wall (8) of the package (6)
Data Source
AI summary
The invention relates to an optoelectronic semiconductor component, comprising a support which has a support element and a first and second contact structure, an optoelectronic semiconductor chip which is arranged on the support and is connected to the first and second contact structure in an electrically conductive manner, and a housing which is connected to the support in a form-fitting manner and has a cavity that is laterally delimited by a reflective housing wall of the housing and is arranged on the face of a first main surface of the support, wherein the wall thickness of the housing.