Micro-LED Reflective Filling Layout for Uniform Viewing Brightness
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Solution Overview
Problem
Existing micro-LED display technologies face challenges in quickly and accurately transferring millions of semiconductor light emitting devices to display panels, and they struggle with light uniformity and luminance issues due to the placement of black matrices.
Innovation Solution
The proposed solution involves a display device design that includes a substrate, a semiconductor light emitting device, a planarization layer, first opaque fillers spaced apart on the planarization layer, and a light reflective filling layer located around and lower than the semiconductor light emitting device, which improves light reflection and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a black matrix is placed on the top of the micro-LED, then color mixing between adjacent pixels is prevented, but luminance difference depending on viewing angle occurs
Solution Approach 1:
The patent extracts the light-blocking function from the traditional top-placed black matrix and relocates it to the bottom of the semiconductor light emitting device. This separation allows the black matrix to perform its color isolation function without interfering with the light emission path, thereby preventing color mixing while avoiding luminance differences caused by viewing angle variations.
Solution Approach 2:
The patent inverts the conventional placement of the black matrix from the top surface to the bottom surface of the light emitting device. This inversion fundamentally changes the optical path interaction, allowing light to escape unobstructed from the top while the black matrix at the bottom prevents lateral light leakage and color mixing between adjacent pixels.
2Object-affected harmful factors
If a black matrix surrounds the micro-LED, then color isolation is improved, but light absorption increases and luminance decreases
Solution Approach 1:
The patent extracts the light-blocking function from the surrounding black matrix configuration and concentrates it at the bottom of the device. This extraction maintains the color isolation benefit while removing the harmful light absorption that occurred when the black matrix surrounded the micro-LED on all sides.
Solution Approach 2:
The patent applies the black matrix only in the specific location where it is most needed - at the bottom of the semiconductor light emitting device - rather than surrounding it completely. This localized application provides sufficient color isolation while minimizing light absorption, as the black matrix is positioned only where lateral light leakage occurs.
3Area of stationary object
If millions of semiconductor light emitting devices are transferred to the display panel, then large-area display is achieved, but transfer accuracy and speed become difficult to maintain
Solution Approach 1:
The patent segments the display into modular units with standardized structures including the substrate, semiconductor light emitting devices, planarization layer, and black matrix. This segmentation allows for systematic assembly and transfer processes, making it feasible to accurately position millions of devices across large areas by treating them as standardized modular components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light efficiency and uniformity by reflecting light emitted from the sides and bottom of the semiconductor light emitting device upward, thereby reducing luminance differences depending on the viewing angle and improving overall brightness.
Implementation Method 1
a light reflective filling layer disposed around the semiconductor light emitting device, wherein the light reflective filling layer is located lower than an upper surface of the semiconductor light emitting device
Data Source
AI summary
A display device including the semiconductor light emitting device according to an embodiment including a planarization layer disposed on the semiconductor light emitting device, a first opaque filler disposed to be spaced apart on the planarization layer, and a light reflective filling layer disposed around the semiconductor light emitting device, wherein the light reflective filling layer is positioned lower than the top surface of the semiconductor light emitting device.