MicroLED Module Sacrificial Layer for Accurate Laser Transfer
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Solution Overview
Problem
Current microLED display devices face challenges with low preparation yield due to fragmentation and debris generation during the transfer process, affecting transfer accuracy and device yield.
Innovation Solution
A light-emitting diode module with a sacrificial protective layer partially located in the second region between first regions on the substrate, which reduces the formation of right-angled structures and debris, improving transfer accuracy and yield by isolating the light-emitting elements from the substrate and laser irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the light-emitting element is transferred from the substrate using laser, then the transfer efficiency is improved, but debris is generated and transfer accuracy deteriorates
Solution Approach 1:
A sacrificial protective layer is introduced as an intermediary between the light-emitting element and the substrate. This layer absorbs laser energy and prevents direct interaction between the laser and the light-emitting element, thereby avoiding debris generation while maintaining efficient transfer. The sacrificial protective layer is removed after transfer, leaving the light-emitting element intact on the target substrate.
Solution Approach 2:
The sacrificial protective layer is designed as a temporary, disposable structure that serves its purpose during the transfer process and is then removed. This layer is intentionally designed to be consumed or discarded after use, protecting the valuable light-emitting element during the transfer operation without requiring complex recovery processes.
2Manufacturing precision
If the light-emitting element is isolated from the substrate, then transfer accuracy is improved, but the structural complexity increases
Solution Approach 1:
The structure is segmented into distinct functional layers: the substrate, the sacrificial protective layer, and the light-emitting element. This segmentation allows the sacrificial protective layer to be selectively removed or processed, isolating the light-emitting element from the substrate during transfer while maintaining overall structural organization and minimizing complexity.
3Object-generated harmful factors
If the sacrificial protective layer is located in the second region between first regions, then debris generation is reduced, but the manufacturing process complexity increases
Solution Approach 1:
The sacrificial protective layer is strategically positioned only in the second region between the first regions where light-emitting elements are located. This localized placement provides protection exactly where needed during transfer, reducing debris generation at critical interfaces while avoiding unnecessary material addition in other areas, thus balancing protection with manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the transfer accuracy and preparation yield of microLED modules by minimizing debris generation and maintaining structural integrity, leading to improved performance and reliability of the final display device.
Implementation Method 1
The light-emitting element and the sacrificial protective layer are simultaneously separated from the first substrate by using a laser, and the light-emitting element and the sacrificial protective layer are transferred to a target substrate.
Data Source
AI summary
Provided are a light-emitting diode module, a preparation method therefor, a transfer method for a light-emitting element, a display panel, and a display device. The light-emitting diode module includes a first substrate, a sacrificial protective layer, and multiple light-emitting elements. The first substrate has multiple first regions arranged at intervals and second regions, where a second region is located between adjacent first regions. The sacrificial protective layer is located on a side of the first substrate and at least partially located in the second region. The multiple light-emitting elements are disposed in the multiple first regions and located on the same side of the first substrate as the sacrificial protective layer.