Micro-LED Adhesive Transfer With Self-Assembly Alignment
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Solution Overview
Problem
Current display device manufacturing processes face challenges in reducing transferring errors of light emitting diodes (LEDs), increasing production efficiency, minimizing manufacturing costs, and minimizing visible recognition of wavelength deviation distribution, particularly in aligning and transferring LEDs onto display panels.
Innovation Solution
A display device design that includes a substrate with defined sub-pixels, an adhesive layer, and self-assembled LEDs, where the LEDs are connected via a reflective electrode and planarization layers, and a manufacturing method involving self-assembly on a substrate followed by transfer onto a donor and then an adhesive layer, utilizing an electric field to simplify alignment and reduce errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional transferring methods are used to transfer LEDs onto the display panel, then the transferring process can be completed, but alignment errors occur during the transferring process
Solution Approach 1:
The LED performs self-alignment through self-assembly on the donor substrate. The LED automatically positions itself at the correct location and orientation on the donor substrate through self-assembly mechanisms, eliminating the need for external alignment tools and reducing alignment errors during the transferring process.
Solution Approach 2:
The LED is pre-aligned and pre-positioned on the donor substrate before the actual transferring process. By completing the alignment action in advance on the donor substrate, the LED is already in the correct position and orientation before being transferred to the final display panel location.
2Area of stationary object
If multiple transferring processes are used to transfer LEDs, then complete coverage can be achieved, but the number of transferring steps increases reducing production efficiency
Solution Approach 1:
Multiple LED chips are transferred together in a single process step by combining them on a common donor substrate. Instead of transferring individual LEDs separately multiple times, the method merges multiple LEDs into one unified transferring operation, reducing the total number of transferring steps while achieving complete display panel coverage.
3Manufacturing precision
If precise alignment of LEDs is achieved through conventional methods, then positioning accuracy can be obtained, but manufacturing cost increases
Solution Approach 1:
The patent replaces complex mechanical alignment systems with a self-assembly mechanism. Instead of using expensive mechanical positioning tools, alignment stages, and precision fixtures, the LED automatically assembles itself on the donor substrate through material interactions, significantly reducing manufacturing equipment costs while maintaining high positioning accuracy.
4Reliability
If LEDs with varying wavelengths are distributed uniformly, then color uniformity is improved, but visible wavelength deviation distribution is minimized
Solution Approach 1:
The patent applies local quality by distributing LEDs with different wavelengths (colors) in a specific spatial pattern across the display panel. Each local region receives LEDs with wavelengths optimized for that position, creating local color uniformity that collectively achieves overall display uniformity while minimizing visible wavelength deviations across the entire panel.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces alignment errors, improves production efficiency, minimizes manufacturing costs, and enhances color uniformity by uniformly distributing LEDs with varying wavelengths, resulting in improved display quality and reduced visible wavelength deviations.
Implementation Method 1
a plurality of light emitting diodes self-assembled which are transferred onto the adhesive layer and disposed in the plurality of sub pixels
Implementation Method 2
self-assembling a plurality of light emitting diodes on an assembling substrate; transferring the plurality of light emitting diodes which is self-assembled on the assembling substrate onto a donor
Data Source
AI summary
According to an aspect of the present disclosure, a display device includes a substrate in which a pixel including a plurality of sub pixels is defined; an adhesive layer disposed on the substrate; and a plurality of light emitting diodes self-assembled which are transferred onto the adhesive layer and disposed in the plurality of sub pixels. Accordingly, the light emitting diode is disposed on the adhesive layer to fix the light emitting diode which is transferred from the donor.