Micro-LED Display Panel Side Wiring for Seamless Bezel-Less Tiling
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Solution Overview
Problem
Current display technologies face challenges in maximizing display area due to the presence of bezels, which limit the active display area and can result in seams when connecting multiple panels, affecting the overall display quality and mounting density of micro-LEDs.
Innovation Solution
A bezel-less display panel design is achieved by forming side wirings at the edge of a TFT substrate to move the bonding area to the rear surface, allowing for increased mounting density of micro-LEDs and seamless connections between panels by maintaining consistent pixel pitches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If bonding area is moved to rear surface using side wiring structure, then active display area is maximized, but manufacturing complexity increases
Solution Approach 1:
The patent moves the bonding area from the front surface to the rear surface of the TFT substrate by routing wiring structures through the thickness dimension of the substrate. This allows the bonding area to be positioned on the rear surface while maintaining electrical connections to the front surface active area, effectively utilizing the third dimension to resolve the spatial conflict between bonding requirements and display area maximization.
Solution Approach 2:
The wiring structure is divided into multiple segments: a first wiring portion extending from the front surface to the rear surface, and a second wiring portion extending from the rear surface bonding area to the edge. This segmentation allows each portion to be optimized independently for its specific function, simplifying the overall manufacturing process despite the three-dimensional configuration.
2Area of stationary object
If bezel area is reduced to maximize display area, then mounting density of micro-LEDs increases, but risk of seam visibility between panels increases
Solution Approach 1:
By positioning the bonding area on the rear surface rather than the front surface edge, the patent enables the outermost pixels to be positioned at the very edge of the front surface. This eliminates the need for front surface bonding areas that would create bezels, allowing panels to be edge-to-edge bonded through the rear surface while maintaining pixel pitch consistency at the visible edges.
3Area of stationary object
If side wiring structure is used to move bonding area to rear surface, then dummy area is minimized, but wiring length and material usage increase
Solution Approach 1:
The wiring structure is concentrated at the edge region of the substrate, with the first wiring portion extending vertically through the substrate thickness and the second wiring portion extending horizontally along the rear surface to the edge. This localized configuration minimizes the overall wiring material required while achieving the goal of moving the bonding area to the rear surface.
Data Source
AI summary
A display panel is provided. The display panel according to an embodiment includes a thin film transistor glass substrate, a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor glass substrate, and a plurality of side wirings formed at an edge of the thin film transistor glass substrate to electrically connect the one surface of the thin film transistor glass substrate to an opposite surface to the one surface.