Micro-LED Light Emitting Structure for Single-Step Die Bonding
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Solution Overview
Problem
The existing micro light emitting structure display technology faces challenges such as element missing defects, interference issues during die bonding processes, and inefficient die bonding times, which affect production yield and capacity.
Innovation Solution
A light emitting element is designed with a base substrate, multiple light emitting structures, a filling layer, a connecting electrode layer, an insulating layer, and pads, where the light emitting structures are packaged together, allowing for a single die bonding process and avoiding interference issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple die bonding processes are performed for micro light emitting structures of different colors, then each color can be precisely bonded, but the die bonding time increases and interference problems occur
Solution Approach 1:
The patent merges multiple die bonding processes into a single integrated process by bonding a multi-color light emitting structure (containing red, green, and blue micro light emitting structures) as one unit to the driving substrate. This combining approach maintains the precision of individual color bonding while eliminating the time consumption and interference issues of sequential bonding processes.
2Manufacturing precision
If multiple die bonding processes are performed for micro light emitting structures of different colors, then each color can be precisely bonded, but interference problems arise during the processes
Solution Approach 1:
By combining multiple color light emitting structures into a single integrated structure that is bonded in one process, the patent eliminates the interference problems that occur when multiple separate die bonding processes are performed sequentially. The unified structure prevents mechanical and positional interference between separate bonding operations.
3Manufacturing precision
If multiple die bonding processes are performed for micro light emitting structures of different colors, then each color can be precisely bonded, but the die bonding efficiency decreases
Solution Approach 1:
The patent improves die bonding efficiency by merging multiple bonding operations into a single process. By bonding the entire multi-color light emitting structure in one step rather than performing separate bonding operations for each color, the overall bonding time is reduced and production efficiency is significantly enhanced while maintaining precision.
4Manufacturing precision
If the size of single light emitting element is small, then high resolution is achieved, but repair for defective pixel cannot be carried out through vacuum adsorption hole
Solution Approach 1:
The patent applies segmentation by dividing the display into modular light emitting elements that can be individually replaced. Each light emitting element is designed as a replaceable unit with a specific size that balances high resolution requirements with the ability to perform repair operations. The vacuum adsorption hole is designed to accommodate the removal and replacement of these segmented elements, enabling repair of defective pixels while maintaining overall high resolution display performance.
Data Source
AI summary
A light emitting element includes a base substrate, light emitting structures on the base substrate, a filling layer among the light emitting structures, a connecting electrode layer, an insulating layer, and pads. The connecting electrode layer is located at a side, away from the base substrate, of the filling layer. The insulating layer is located at a side, away from the filling layer, of the connecting electrode layer. The pads are located at a side, away from the connecting electrode layer, of the insulating layer. Each light emitting structure includes a first pole and a second pole. The connecting electrode layer includes connecting electrodes each connected to the first pole or the second pole of at least one light emitting structure. The light emitting element further includes holes in the insulating layer. The pads are connected to the connecting electrodes through the holes.