Micro-LED Display Substrate Blocker for Laser Die Removal

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The current method of manufacturing micro-LED display devices using mass transfer techniques often results in dislocated dies, which are removed with a laser, causing damage to the circuit substrate and reducing production yield and reliability.

Innovation Solution

Incorporating a blocker on the circuit substrate that aligns with the connecting portions of the light-emitting elements, preventing laser light from directly impacting the substrate during die removal and repair.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of repair

If laser is used to remove dislocated micro-LED dies, then die removal is achieved, but circuit substrate is damaged

Engineering Contradiction:

Improvedie removalVSAvoidsubstrate damage

Core Design Contradiction:

Ease of repairVSObject-affected harmful factors

Solution Approach 1:

A blocker structure is introduced as an intermediary element between the laser beam and the circuit substrate. The blocker absorbs or reflects the laser energy, preventing it from reaching and damaging the substrate while allowing complete die removal. This mediator structure resolves the contradiction by decoupling the die removal function from the substrate damage harm.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The blocker is pre-positioned on the circuit substrate before laser removal occurs. This preliminary protective action creates a shield that prevents the harmful laser effects from reaching the substrate, thereby eliminating the substrate damage that would otherwise occur during the necessary die removal process.

Inventive Principle:

Principle #9Preliminary anti-action

2Productivity

If mass transfer technique is used to place micro-LED dies, then large number of dies are transferred at once, but die dislocation occurs

Engineering Contradiction:

Improvedie transfer efficiencyVSAvoiddie positioning accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The blocker structure is prepared and positioned on the circuit substrate before the mass transfer process occurs. This preliminary arrangement enables subsequent laser removal and re-implantation operations to be performed with proper protection, allowing the mass transfer technique to maintain its high productivity while providing a correction mechanism for any positioning errors that occur.

Inventive Principle:

Principle #10Preliminary action

3Ease of repair

If laser is used for die removal, then dislocated dies are removed, but production yield decreases due to substrate damage

Engineering Contradiction:

Improvedie removal capabilityVSAvoidproduction yield

Core Design Contradiction:

Ease of repairVSProductivity

Solution Approach 1:

The blocker serves as a protective intermediary that enables laser-based die removal without the harmful side effects. By preventing substrate damage, the blocker ensures that repair operations do not compromise overall production yield, thus maintaining both ease of repair and productivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The blocker converts the potentially harmful laser energy into a beneficial process by selectively absorbing or reflecting it. The laser remains useful for die removal, but its harmful effects on the substrate are converted into a controlled interaction with the blocker, which protects the substrate while allowing the repair process to proceed.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The blocker shields the circuit substrate from laser damage, enhancing production yield and reliability by ensuring accurate die removal without substrate harm.

Implementation Method 1

a blocker located on the circuit substrate... the third side and the fourth side of the blocker are aligned with a side of the first connecting portion and a side of the second connecting portion

Methodology Applied

Scientific EffectLight absorption: Absorption (EM radiation)

Data Source

PatentUS12356774B2Display device

Publication Date: 2025.07.08 AU OPTRONICS CORP

AI summary

A display device includes a circuit substrate, a blocker, a first and second pad located on the circuit substrate, a light-emitting element, and a first and second connecting portion. The blocker is located on the circuit substrate, and has an opposite first and second side and an opposite third and fourth side. The first pad is adjacent to the first side of the blocker. The second pad is adjacent to the second side of the blocker. The light-emitting element is located on the blocker and the first and second pads, and includes a first and second electrode. The first connecting portion is connected to the first electrode and the first pad. The second connecting portion is connected to the second electrode and the second pad. The third and fourth sides of the blocker are aligned with a side of each of the first and second connecting portions.