MicroLED Display Panel Substrate Segmentation for Drive Circuit Integration
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Solution Overview
Problem
Existing microLED display panels face challenges with thermal mismatch between flip chip technology and CMOS processes, leading to small drive currents and malfunctions in large-size or high-resolution displays, particularly due to leakage current and unsuitable passive matrix driving schemes.
Innovation Solution
A microLED display panel design that employs a passive driving method with divided substrates and integrated drivers, reducing loading on drive circuits and minimizing leakage current effects, while using recesses in the substrate to accommodate drivers and optimize light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If passive matrix driving scheme is used, then device complexity is reduced and manufacturing process is simplified, but drive current increases causing gray display issues due to leakage current
Solution Approach 1:
The substrate is divided into multiple sub-regions with each region having its own dedicated drive circuits. This segmentation reduces the loading on individual drive circuits, allowing passive matrix driving to be used while minimizing leakage current effects and maintaining gray display performance.
2Device complexity
If drive circuits are disposed on periphery only, then device complexity is reduced, but output loading and delay increase causing malfunction in large-size displays
Solution Approach 1:
Instead of concentrating drive circuits only on the periphery, the substrate is divided into sub-regions with drive circuits distributed across multiple locations. This segmentation reduces output loading and delay by limiting the distance signals must travel, enabling large-size displays to operate reliably.
3Manufacturing precision
If flip chip technology is used for microLED, then manufacturing precision is improved, but thermal mismatch with CMOS process occurs affecting drive current
Solution Approach 1:
A substrate is introduced as an intermediary between the microLEDs (made by flip chip technology) and the drive circuits (made by CMOS process). This substrate acts as a thermal buffer that decouples the thermal characteristics of the two technologies, preventing thermal mismatch while maintaining the manufacturing precision benefits of flip chip technology.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables feasible large-size high-resolution microLED displays with reduced turn-on time, increased drive current, and minimized gray display issues, simplifying the manufacturing process and maintaining the advantages of microLED technology.
Implementation Method 1
A micro light-emitting diode (microLED, mLED or μLED) display panel is one of flat display panels, which is composed of microscopic microLEDs
Data Source
AI summary
A microLED display panel includes a substrate being divided into a plurality of sub-regions for supporting microLEDs, and a plurality of drivers being correspondingly disposed on surfaces of the sub-regions respectively. In one embodiment, a top surface of the substrate has a recess for accommodating the driver.