MicroLED Transfer Contact Structure to Protect Bridge Members
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Solution Overview
Problem
The mass production of microLEDs is hindered by the low success rate of transfer printing due to the fragility of the bridge member during the transfer process, which can cause microLEDs to fall into the open cavity of the bonding layer, leading to damage and reduced transfer efficiency.
Innovation Solution
A micro light-emitting element with a protruding contact member that extends beyond the bridge connection member, allowing for contact with a transfer means without applying force directly on the bridge member, thereby preventing damage and facilitating successful transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional transfer stamp with spaced apart stamp protrusions is used to transfer micro light-emitting elements, then transfer of microLEDs can be achieved, but the bridge member may break due to applied force causing microLEDs to fall into the open cavity and reducing transfer success rate
Solution Approach 1:
The invention divides the contact interface into two distinct functional parts: the bridge member for structural support and the protruding contact member for force application. This segmentation allows the bridge member to maintain structural integrity while the protruding contact member handles the mechanical stress of transfer, preventing bridge member breakage and improving transfer success rate.
Solution Approach 2:
The protruding contact member acts as an intermediary between the transfer stamp and the microLED device. Instead of applying force directly to the bridge member, the transfer stamp contacts the protruding contact member which then transmits the force to separate the microLED from the support structure. This intermediary protects the bridge member from direct mechanical stress.
2Manufacturing precision
If the stamp protrusions are precisely dimensioned to match microLED size, then transfer precision can be improved, but the production complexity of the transfer stamp increases
Solution Approach 1:
The invention adds a vertical dimension to the contact interface by creating protruding contact members that extend beyond the plane of the microLED. This dimensional change allows the transfer stamp to contact the microLED device at a higher point, enabling simpler, less precisely dimensioned stamp protrusions while maintaining accurate transfer positioning.
Solution Approach 2:
The protruding contact members are pre-formed as part of the microLED device structure before transfer. This preliminary action creates ready-made contact points that simplify the transfer stamp design, as the stamp only needs to contact these pre-positioned protrusions rather than precisely matching the microLED dimensions.
Data Source
AI summary
A micro light-emitting device includes a support structure with a cavity and at least one micro light-emitting element that includes a semiconductor structure accommodated by the cavity, at least one bridge connection member disposed on the semiconductor structure to interconnect the semiconductor structure and the support structure, and a protruding contact member disposed on at least one of the semiconductor structure and the bridge connection member and protruding therefrom to be configured to contact with a transfer means. The device is configured to contact with the transfer means at the protruding contact member of the element. A transfer method using the device is also disclosed.