Micro-LED Transfer Assembly With Inline Inspection and Magnetic Pickup

The patent performs preliminary assembly inspection before the transfer process. The inspection unit detects whether semiconductor light emitting devices are properly assembled on the carrier substrate before transfer occurs. This preliminary detection prevents defective devices from being transferred, thereby maintaining high transfer yield while enabling high transfer speed through batch processing of inspected devices.

The patent implements a feedback mechanism where inspection results from the assembly inspection unit are used to control the transfer process. The system selectively transfers only those devices that pass inspection, using the inspection feedback to determine transfer eligibility. This feedback loop ensures high transfer yield by preventing defect propagation while maintaining efficient transfer speed through automated selective transfer.

The patent merges the assembly inspection process with the transfer process into an integrated system. The inspection unit and transfer unit operate in close coordination, with inspection results directly informing transfer decisions. This merging eliminates separate inspection and transfer steps, allowing simultaneous inspection and preparation for transfer, thereby maintaining high transfer yield through continuous monitoring while preserving high transfer speed through streamlined batch processing.

The patent maintains continuous operation by performing inspection and transfer in an integrated, continuous manner. Rather than stopping for separate inspection steps, the system continuously inspects devices as they are prepared for transfer and immediately transfers inspected devices without interruption. This continuous action ensures high transfer yield through uninterrupted quality control while maintaining high transfer speed through elimination of idle time.