Micro-LED Bonding with Vacuum Pressing for Large-Area Accuracy
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Solution Overview
Problem
The challenge in manufacturing large-sized LED displays lies in achieving accurate pressing, high production yield, and effective repair of defective pixels, particularly due to issues with transferring micro-LED chips from a transfer substrate to a target substrate, which requires advanced equipment and materials.
Innovation Solution
A device and method that utilize a carrying platform, a flexible pressing element, a closed space generating mechanism, and an energy generating mechanism to bond electronic components, specifically using a combination of vacuum extraction and an elastomer to ensure precise and even pressure for bonding micro-LED chips onto a target substrate, facilitated by a gas extracting mechanism and energy beam application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional pressing methods are used to transfer micro-LED chips from transfer substrate to target substrate, then the process is simple, but large-area pressing accuracy deteriorates
Solution Approach 1:
The patent replaces conventional mechanical pressing systems with a vacuum-based closed space system. By creating a vacuum environment within a closed space formed by the elastomer and substrate, the system achieves uniform distribution of pressing force across large areas without complex mechanical linkages, thereby improving pressing accuracy while controlling equipment complexity
Solution Approach 2:
The patent changes the physical state of gas within the closed space by creating vacuum conditions. This parameter change (from atmospheric pressure to vacuum) enables the elastomer to conform uniformly to the substrate surface, achieving consistent pressing accuracy across large areas without requiring complex mechanical adjustment mechanisms
2Reliability
If vacuum extraction is used to create negative pressure for even pressing, then bonding quality improves, but device complexity increases
Solution Approach 1:
The patent creates a vacuum (inert environment free of air) within the closed space to enable uniform pressing. The vacuum environment eliminates air pockets and allows the elastomer to conform perfectly to the substrate, ensuring high bonding quality. The sealed nature of the closed space maintains this inert environment throughout the bonding process
Solution Approach 2:
The patent uses an elastomer as a flexible sealing element that forms the closed space. This flexible film adapts to the substrate surface contours while maintaining the vacuum environment, ensuring uniform pressure distribution and high bonding quality without requiring complex rigid pressing mechanisms
3Adaptability or versatility
If rigid pressing structures are used, then structural stability is good, but adaptability to substrate variations deteriorates
Solution Approach 1:
The patent employs an elastomer as a flexible sealing and pressing element that can adapt to various substrate shapes, sizes, and surface variations. This flexible film maintains structural integrity while conforming to different geometries, providing both adaptability to substrate variations and sufficient structural stability for the bonding process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the bonding quality and manufacturing yield of LED displays by ensuring even pressure and precise alignment, addressing the challenges of large-area pressing accuracy and defective pixel repair, thereby improving the production efficiency for large-sized displays.
Implementation Method 1
The gas extracting mechanism is configured to extract gas from the closed space
Implementation Method 2
generating a negative pressure in the closed space, thereby making the elastomer press on either the carrying substrate or the target substrate
Implementation Method 3
applying an energy beam onto the carrying substrate or the target substrate to bond the electronic component on the target substrate from the carrying substrate
Data Source
AI summary
A device configured to bond an electronic component includes a carrying platform, a pressing element, a closed space generating mechanism, a gas extracting mechanism, and an energy generating mechanism. The carrying platform is configured to carry a target substrate and a carrying substrate carrying the electronic component on the target substrate. The pressing element is made of a flexible material. The closed space generating mechanism is capable of putting the pressing element onto the carrying platform, so as to form a closed space between the pressing element and the carrying platform. The gas extracting mechanism is configured to extract gas from the closed space. The energy generating mechanism is disposed near the carrying platform, and configured to generate energy toward the carrying platform. A method for bonding an electronic component and a method for manufacturing a light-emitting diode (LED) display are also provided.