Micro-LED Assembly Wiring Layout to Prevent Corrosion and Capacitance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micro-LED displays face challenges in quickly and accurately transferring micro-LEDs due to corrosion of assembly wiring, weakened assembly force, non-uniform self-assembly rates, and increased panel thickness, particularly with the self-assembly method using dielectrophoresis (DEP), which results in defects and parasitic capacitance.
Innovation Solution
A display device design featuring alternately arranged first and second assembly wirings with a planarization layer and insulating layer, where the semiconductor light-emitting device is electrically connected to one of the assembly wirings, and clad layers are used to prevent corrosion and enhance assembly force, while a grounding pad eliminates parasitic capacitance, allowing for precise control of spacing and reduced panel thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to transfer micro-LEDs, then large-screen display assembly becomes feasible, but assembly wiring corrosion by fluid causes electrical short circuit and assembly defects
Solution Approach 1:
The patent introduces an insulating layer as an intermediary substance between the assembly wiring and the light-emitting device. This insulating layer prevents direct contact between the conductive assembly wiring and the fluid environment, thereby eliminating corrosion while maintaining the electrical connection function. The insulating layer acts as a mediator that allows the self-assembly process to proceed without compromising wiring reliability.
2Strength
If assembly wiring thickness is increased to strengthen assembly force, then light-emitting device bonding becomes stronger, but substrate thickness increases
Solution Approach 1:
The patent employs a composite structure for the assembly wiring consisting of multiple layers with different functions: a conductive layer for electrical connection, an insulating layer for protection, and potentially additional structural layers. This composite material approach allows the wiring to achieve sufficient mechanical strength for assembly while maintaining a compact overall thickness that does not excessively increase substrate thickness.
3Ease of manufacture
If steps and gaps between assembly wiring are present, then wiring structure becomes simpler, but assembly force for light-emitting device is weakened
Solution Approach 1:
The patent transitions from a two-dimensional planar wiring structure to a three-dimensional structure by adding vertical layering with the insulating layer. This dimensional change allows the wiring to maintain strong assembly force through vertical bonding while keeping the horizontal footprint compact. The insulating layer extends vertically to provide both mechanical support and electrical isolation, resolving the conflict between structural simplicity and assembly strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the self-assembly rate, minimizes defects and corrosion, stabilizes bonding, and reduces panel thickness by using resistant clad layers and a grounding pad to manage parasitic capacitance, enabling efficient and precise assembly of micro-LEDs.
Implementation Method 1
a semiconductor light emitting device having a first electrode, disposed inside the first opening, and overlapping the first assembly wiring and the second assembly wiring
Implementation Method 2
a self-assembly transfer process using dielectrophoresis (DEP), but there is a problem with a low self-assembly rate due to the non-uniformity of the DEP force
Data Source
AI summary
A display device including a semiconductor light emitting device according to an embodiment can include a substrate, first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having a first opening, and a light emitting device disposed inside the first opening, wherein the first electrode overlaps the plurality of first assembly wirings and the plurality of second assembly wirings. The first electrode may be electrically connected to one of the first assembly wiring and the second assembly wiring.