Micro-LED Assembly Wiring Layout to Prevent Corrosion Shorts

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Solution Overview

Problem

Micro-LED displays face challenges in quickly and accurately transferring micro-LEDs due to corrosion of assembly wiring during the self-assembly process, leading to electrical short circuits and increased resistance, which affects assembly rate and reliability.

Innovation Solution

A display device design featuring alternately arranged first and second assembly wirings on a substrate with a planarization layer and a semiconductor light emitting device, where the assembly wiring connection pattern electrically connects the wires, minimizing corrosion and ensuring the same potential across the assembly wiring, thus enhancing assembly force and resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If self-assembly method is used to transfer micro-LEDs, then assembly efficiency is improved, but assembly wiring corrosion occurs leading to electrical short circuits

Engineering Contradiction:
Improveassembly efficiencyVSAvoidelectrical short circuit prevention
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent introduces an insulating film as an intermediary layer between the assembly wiring and the fluid environment. This mediator prevents direct contact between the wiring and corrosive fluid, thereby maintaining electrical reliability while preserving the benefits of self-assembly transfer method.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a sacrificial layer that is intentionally designed to be temporary and disposable. This layer provides protective function during the self-assembly process and is subsequently removed, enabling reliable electrical connection without requiring permanent complex protective structures on the wiring.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Ease of operation

If multiple assembly wirings with different potentials are used, then electrical connection capability is improved, but resistance increases making signal transmission difficult

Engineering Contradiction:
Improveelectrical connection capabilityVSAvoidsignal transmission quality
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent applies equipotentiality principle by connecting assembly wirings with different potentials through conductive structures, creating equipotential regions that reduce voltage differences and minimize resistance effects, thereby improving signal transmission quality while maintaining electrical connection capability.

Inventive Principle:
Principle #12Equipotentiality

Solution Approach 2:

The patent merges multiple assembly wirings with different potentials into integrated conductive structures that share common reference potentials. This combining approach reduces the overall resistance impact and improves signal transmission by eliminating potential differences between separate wiring systems.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If assembly wiring is exposed to fluid during self-assembly, then self-assembly process is enabled, but corrosion occurs reducing assembly reliability

Engineering Contradiction:
Improveself-assembly process implementationVSAvoidassembly wiring durability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces an insulating film as a protective intermediary between the assembly wiring and the fluid environment. This mediator enables the self-assembly process to proceed while preventing corrosive fluid from degrading the wiring, thus maintaining both process feasibility and wiring durability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies preliminary protective actions by forming insulating coatings and sacrificial layers on the assembly wiring before exposing it to the fluid environment during self-assembly. This pre-protection ensures the wiring survives the corrosive environment without compromising the self-assembly process.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20240186473A1Display device comprising semiconductor light emitting element
Publication Date: 2024.06.06 LG DISPLAY CO LTD
  • US20240186473A1 patent drawing
  • US20240186473A1 patent drawing
  • US20240186473A1 patent drawing

AI summary

A display device including a semiconductor light emitting device according to an embodiment includes a substrate, first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having a first opening, a semiconductor light emitting device disposed inside the first opening and having a first electrode overlapping the first assembled wiring and the second assembled wiring, and an assembly wiring connection pattern that electrically connects the first assembly wiring and the second assembly wiring. And first electrode can be electrically connected to one of the first assembly wiring and the second assembly wiring.