Micro-LED Display Wiring Structure for Corrosion-Safe Self-Assembly

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Solution Overview

Problem

The technical challenge lies in the difficulty of quickly and accurately transferring micro-LEDs for large micro-LED displays, where self-assembly methods face issues with corrosion of assembly wiring and potential damage due to force during the assembly process, leading to electrical short circuits and defects.

Innovation Solution

A display device design featuring alternately arranged assembly wirings with varying thickness insulating layers and conductive clad layers to prevent corrosion, reduce short circuits, and enhance the assembly process, including a substrate with sub-pixels and a planarization layer with specific openings for light emitting devices, allowing for precise spacing and stable bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If self-assembly method is used to transfer micro-LEDs, then assembly efficiency is improved, but assembly wiring corrosion occurs causing electrical short circuits

Engineering Contradiction:
Improveassembly efficiencyVSAvoidelectrical short circuit prevention
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent introduces a fluid-resistant coating layer as an intermediary between the assembly wiring and the fluid environment. This coating acts as a mediator that prevents direct contact between the wiring and corrosive fluid, thereby eliminating corrosion while maintaining the self-assembly process in fluid medium.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a protected environment around the assembly wiring by applying fluid-resistant coating, effectively creating an inert zone that excludes the corrosive fluid. This allows the wiring to remain unaffected by the fluid environment while the self-assembly process proceeds in the fluid medium.

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

2Productivity

If self-assembly method is used to transfer micro-LEDs, then assembly efficiency is improved, but assembly force causes device damage

Engineering Contradiction:
Improveassembly efficiencyVSAvoiddevice damage resistance
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

The patent applies fluid-resistant coating to the assembly wiring before the self-assembly process begins. This pre-protection measures prevents direct fluid-wiring contact that would cause corrosion during the assembly process, cushioning against potential damage before it occurs.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If thick insulating layer is used between assembly wirings, then corrosion prevention is improved, but assembly precision decreases

Engineering Contradiction:
Improvecorrosion preventionVSAvoidassembly precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies fluid-resistant coating selectively to specific regions where corrosion protection is needed, rather than uniformly thick insulation everywhere. This localized protection maintains precision in critical assembly areas while providing adequate corrosion prevention where fluid contact is most problematic.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20240304774A1Display device comprising semiconductor light-emitting element
Publication Date: 2024.09.12 LG ELECTRONICS INC
  • US20240304774A1 patent drawing
  • US20240304774A1 patent drawing
  • US20240304774A1 patent drawing

AI summary

The display device according to the embodiment includes a substrate; a first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other; a first insulating layer disposed between the first assembly wiring and the second assembly wiring and having different first and second thicknesses; a planarization layer disposed on the first assembly wiring and the second assembly wiring and having a first opening; and a light emitting device disposed inside the first opening, wherein a first electrode overlaps the first assembly wiring and the second assembly wiring, wherein the first electrode is configured to be electrically connected to either the first assembly wiring or the second assembly wiring.