Micromechanical Acceleration Sensor With Through-Substrate Contacts
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Solution Overview
Problem
Existing micromechanical acceleration sensors face challenges in manufacturing cost-effectiveness and miniaturization, particularly in creating a displaceable mass that can move in three spatial directions while maintaining reliable electrical contacts and protection against foreign materials.
Innovation Solution
A manufacturing method for micromechanical components using silicon microsystem technology, allowing for the creation of a displaceable mass and frame from various materials, including silicon, metal, and semiconductor materials, with through contacts and trench etching to ensure electrical connectivity and reduced size, enabling a cost-effective, compact acceleration sensor with a single displaceable mass capable of detecting acceleration in all three dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a displaceable mass is structured out of a silicon substrate using conventional methods, then the sensor can detect acceleration in three spatial directions, but the manufacturing process becomes complex and costly
Solution Approach 1:
The patent combines the displaceable mass and frame into a single integrated silicon substrate structure, eliminating the need for separate structuring processes. The through contacts are formed by etching directly through the substrate, merging the contact formation step with the structural fabrication, thereby simplifying the manufacturing process while maintaining 3D acceleration detection capability
Solution Approach 2:
The silicon substrate serves multiple functions simultaneously: it provides the structural frame, contains the displaceable mass, and forms the through contacts for electrical connectivity. This multi-functionality reduces the number of manufacturing steps and components needed, addressing the complexity issue while preserving versatile acceleration sensing
2Reliability
If protective caps and bonding frames are added to protect against foreign materials, then reliability improves, but installation space and mass increase
Solution Approach 1:
The patent extracts and eliminates the protective cap and bonding frame components by forming through contacts directly through the silicon substrate. The substrate itself is designed to provide both structural support and electrical connectivity, removing the need for additional protective housings and reducing the overall device volume and installation space
Solution Approach 2:
The silicon substrate is designed to be self-sufficient by integrating all necessary functions: structural support, displaceable mass containment, and electrical contact pathways. The through contacts provide both mechanical strength and electrical connectivity without requiring external bonding frames, allowing the device to be compact while maintaining reliability
3Reliability
If multiple separate contacts are formed for electrical connectivity, then reliable electrical contact is ensured, but manufacturing steps increase
Solution Approach 1:
The patent merges multiple contact formation operations into a single through-substrate etching process. The through contacts are created in one continuous step that establishes electrical pathways from the front to back surface, ensuring reliable contact while improving manufacturing efficiency by reducing the number of discrete processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method simplifies the manufacturing process, reduces costs, and allows for a compact, multi-directional acceleration sensor with a small mass, suitable for various applications, while eliminating the need for protective caps and bonding frames, thus minimizing installation space and mass.
Implementation Method 1
at least one second trench may be produced to form the at least one through contact, the at least one second trench being etched in the first direction
Data Source
AI summary
A micromechanical component comprising a displaceable mass made of a substrate material having at least one actuator plate electrode and one first insulating layer between the displaceable mass and the at least one actuator plate electrode, a mounting having a frame, which at least partially encloses the displaceable mass, at least one contact terminal of the at least one actuator plate electrode, and at least one stator plate electrode, and at least one spring component, via which the displaceable mass is connected to the mounting, one of the actuator plate electrodes being connected to the assigned contact terminal in each case via the assigned spring component, wherein the frame of the mounting is made of the substrate material of the displaceable mass and wherein one of the actuator plate electrodes is configured in one piece with the assigned contact terminal and the assigned spring component in each case.