Forming Microstructural Systems TRIZ Cases
- Electrostatic Moiré Superlattice Spacing Adjustment in 2-D Heterostructures
Electrostatic rotation adjusts the angle between stacked 2-D layers after fabrication, improving Moiré spacing control, yield, and process efficiency.
- Getter-Encapsulated Thermal Detector Stack for Etch Protection
A composite sacrificial-layer process protects getter material during dual etching while preserving detector-stack strength in radiation sensors.
- Sensing Unit Support Layout for Larger Absorption Area
By placing the support between the circuit layer and sensing part, this case expands sensing area while maintaining electromagnetic absorption.
- Laser-Assisted Wafer Joining with a Heat-Absorbing Layer
A heat-absorbing layer converts laser light into localized heat for wafer joining, cutting thermal stress, process time, and sensor damage.
- Laser Sealing of Membrane Vent Holes With Controlled Surface Asperity
Continuous dual-region laser pulses smooth vent-hole seals by controlling solidification and reducing rough seal-edge asperity in IMUs.
- Micromechanical Element Clamping With a Bent Flexible Rod
A bent flexible rod between fulcrums clamps a micromechanical element against an abutment, preventing reverse motion with finer positioning.
- Micro Normally-Closed Reed Switch via Transient Base Anchoring
A micro normally-closed reed switch uses a transient base to anchor a flexible arm in an electrically conducting state.
- Single Off-Center Tether for Micro-Device Release
A single off-center tether suspends micro-devices above a native substrate to enable controlled release during transfer printing.